N,N-dimethyl-N',N'-diphenyl-urea | 2990-01-4

• 分子结构分类: 有机化合物 - 苯类化合物 - 苯和取代衍生物
• 英文名称: N,N-dimethyl-N',N'-diphenyl-urea
• 英文别名: N,N-Dimethyl-N',N'-diphenyl-harnstoff；N.N-Diphenyl-N.N-dimethylharnstoff；N,N-Dimethyl-diphenyl-harnstoff；Dimethyl-diphenyl-harnstoff；1,1-Diphenyl-3,3-dimethylurea；1,1-dimethyl-3,3-diphenylurea
• CAS: 2990-01-4
• 化学式: C₁₅H₁₆N₂O
• 分子量: 240.305
• InChiKey: JPMQWSJHCDLANT-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  2.8
• 重原子数：
  18
• 可旋转键数：
  2
• 环数：
  2.0
• sp3杂化的碳原子比例：
  0.13
• 拓扑面积：
  23.6
• 氢给体数：
  0
• 氢受体数：
  1

反应信息

• 作为反应物：
  描述：

  N,N-dimethyl-N',N'-diphenyl-urea 在 tetraphosphorus decasulfide 作用下， 以 苯 为溶剂， 生成 N.N-Diphenyl-N.N-dimethylthioharnstoff
  参考文献：
  名称：

  Voss,J., Justus Liebigs Annalen der Chemie, 1971, vol. 746, p. 92 - 101

  摘要：

  DOI：
• 作为产物：
  描述：

  非草隆 、 三苯基铋 在 copper diacetate 、 三乙胺 作用下， 以 二氯甲烷 为溶剂， 反应 36.0h， 以77%的产率得到N,N-dimethyl-N',N'-diphenyl-urea
  参考文献：
  名称：

  促进NH与三芳基铋和乙酸铜的反应

  摘要：

  描述了在叔胺促进剂例如三乙胺或吡啶的存在下，在室温下用三芳基铋和乙酸铜将各种不同的含NH的化合物芳基化。这种温和而高效的方法是基于Barton在胺的芳基化方面的早期工作而开发的，可用于酰胺，酰亚胺，脲，氨基甲酸酯和磺酰胺。

  DOI：

  10.1016/s0040-4039(96)02116-8

文献信息

• Catalyst composition for hydrogenation and method for hydrogenation using the same
  申请人：Asahi Kasei Chemicals Corporation

  公开号：US10016749B2

  公开（公告）日：2018-07-10

  A catalyst composition for hydrogenation including (A) to (D), in which a mass ratio ((C)/(A)) is 0.1 to 4.0 and a mass ratio ((D)/(A)) is 0.01 to 1.00, (A): a titanocene compound represented by formula (1), (wherein R5 and R6 are any group selected from hydrogen, a hydrocarbon group having 1 to 12 carbon atoms, an aryloxy group, an alkoxy group, a halogen group, and a carbonyl group. R1 and R2 are any group selected from the group consisting of hydrogen and a hydrocarbon group having 1 to 12 carbon atoms, and R1 and R2 are not all hydrogen atoms or all a hydrocarbon group having 1 to 12 carbon atoms), (B): a reductant formed from a compound containing an element selected from the elements Li, Na, K, Mg, Zn, Al, and Ca, (C): an unsaturated compound having a molecular weight of 400 or less, and (D): a polar compound.

  一种用于加氢的催化剂组合物，包括(A)至(D)，其中质量比((C)/(A))为0.1至4.0，质量比((D)/(A))为0.01至1.00， (A)：由公式(1)表示的钛环戊二烯基化合物， （其中R5和R6是从氢、具有1至12个碳原子的烃基、芳氧基、烷氧基、卤素基和羰基中选择的任何基团。R1和R2是从氢和具有1至12个碳原子的烃基组成的组中选择的任何基团，且R1和R2不全是氢原子或全部为具有1至12个碳原子的烃基）， (B)：由含有选自Li、Na、K、Mg、Zn、Al和Ca元素的化合物的还原剂形成， (C)：分子量400或以下的非饱和化合物，以及 (D)：极性化合物。
• Nickel-Catalyzed Kumada Coupling of Boc-Activated Aromatic Amines via Nondirected Selective Aryl C–N Bond Cleavage
  作者：Zheng-Bing Zhang、Chong-Lei Ji、Ce Yang、Jie Chen、Xin Hong、Ji-Bao Xia

  DOI：10.1021/acs.orglett.9b00242

  日期：2019.2.15

  A nickel-catalyzed Kumada coupling of aniline derivatives was developed by selective cleavage of aryl C–N bonds under mild reaction conditions. Without preinstallation of an ortho directing group on anilines, the cross-coupling reactions of Boc-protected aromatic amines with aryl Grignard reagents afforded unsymmetric biaryls. Mechanistic studies by DFT calculations revealed that the nickel-mediated

  通过在温和的反应条件下选择性裂解芳基C–N键，开发了镍催化的苯胺衍生物的Kumada偶联。没有在苯胺上预先安装邻位导向基团，Boc保护的芳族胺与芳基格氏试剂的交叉偶联反应提供了不对称的联芳基。通过DFT计算进行的机理研究表明，镍介导的C–N键裂解是限速步骤。
• Photosensitive polymer composition, method for forming relief patterns, and electronic parts
  申请人：——

  公开号：US20010031419A1

  公开（公告）日：2001-10-18

  A positive-type, heat-resistant photosensitive polymer composition comprising (a) a polyimide precursor or a polyimide which is soluble in an aqueous alkaline solution, (b) a compound capable of generating an acid when exposed to light, and (c) a compound having a phenolic hydroxyl group; a method of forming a relief pattern comprising a step of applying the composition onto a substrate and drying it thereon, a step of exposing it, a step of developing it, and a step of heating it; and an electronic part having as a surface-protecting film or an interlayer insulating film.

  一种正型、耐热、光敏聚合物组合物，包括(a)聚酰亚胺前体或可溶于水性碱性溶液的聚酰亚胺，(b)一种能在光照下产生酸的化合物，以及(c)一种具有酚羟基的化合物；一种形成浮雕图案的方法，包括将该组合物涂覆在基板上并在其上干燥，曝光，显影和加热的步骤；以及作为表面保护膜或层间绝缘膜的电子部件。
• Process for making diene polymer rubbers
  申请人：NIPPON ZEON CO., LTD.

  公开号：EP0180141A1

  公开（公告）日：1986-05-07

  A process for making a diene polymer rubber which comprises reacting an active diene polymer rubber having alkali metal and/or alkaline earth metal terminals, which is obtained by polymerizing a conjugated diene monomer alone or together with an aromatic vinyl monomer in a hydrocarbon solvent, using an alkali metal and/or alkaline earth metal initiator, with (1) a tin compound expressed by the general formula RaSnXb (in which R stands for an alkyl, alkenyl, cycloalkenyl or aromatic hydrocarbon group; X is a halogen atom; a is an integer of 0-2, and b is an integer of 2-4), and (2) at least one organic compound selected from the group consisting of aminoaldehydes, aminoketones, aminothioaldehydes, aminothioketones and the organic compounds having in their molecules (in which A stands for an oxygen or sulfur atom).

  一种制造二烯聚合物橡胶的工艺，包括将具有碱金属和/或碱土金属端基的活性二烯聚合物橡胶与以下物质反应，该活性二烯聚合物橡胶是通过使用碱金属和/或碱土金属引发剂，在烃类溶剂中将共轭二烯单体单独或与芳香乙烯基单体一起聚合而得到的 (1) 通式 RaSnXb 所表示的锡化合物（其中 R 代表烷基、烯基、环烯基或芳香烃基；X 为卤素原子；a 为 0-2 的整数，b 为 2-4 的整数），以及 (2) 至少一种有机化合物，选自氨基醛、氨基酮、氨基硫代醛、氨基硫代酮和在其分子 中具有以下特征的有机化合物所组成的组 (其中 A 代表氧原子或硫原子）。
• Epoxy resin systems and methods
  申请人：CENTURY ADHESIVES CORP.

  公开号：EP0303468A2

  公开（公告）日：1989-02-15

  A one-part composition for application to a substrate, e.g., automotive metal body panels, to provide reinforcement thereto is a thixotropic admixture containing as essential components (a) a heat curable epoxy resin system including the reaction product in the presence of a catalyst of at least one epoxy resin with a carboxy terminated elastomer, (b) dicyandiamide, and (c) a plurality of inorganic particulate filler materials, at least one of which is capable of imparting thixotropic properties to the composition. The method of reinforcing the substrate involves coating the one-part epoxy resin containing composition onto at least a portion thereof in a heated condition and thereafter curing the composition at a temperature higher than the coating temperature. Resulting reinforced substrates have tenaciously adhered thereto on at least a portion of one surface thereof a thermoset layer formed by the hot coating and then curing thereon of the thixotropic composition.

  一种用于基材（如汽车金属车身面板）的单组分组合物是一种触变性混合物，其基本成分包括：(a)热固化环氧树脂体系，包括至少一种环氧树脂与羧基端弹性体在催化剂存在下的反应产物；(b)双氰胺；(c)多种无机颗粒填料，其中至少一种能赋予组合物触变性能。加固基材的方法包括在加热状态下将含有单组分环氧树脂的组合物涂覆在基材的至少一部分上，然后在高于涂覆温度的温度下固化组合物。加固后的基材至少在其一个表面的一部分上顽固地附着了由热涂层和触变性组合物固化形成的热固性层。