申请人:Ther United States of America as represented by the Administrator of the
公开号:US05412066A1
公开(公告)日:1995-05-02
Four phenylethynyl amine compounds--3 and 4-aminophenoxy-4'-phenylethynylbenzophenone, and 3 and 4-amino-4'-phenylethynylbenzophenone--were readily prepared and were used to endcap imide oligomers. Phenylethynyl-terminated amide acid oligomers and phenylethynyl-terminated imide oligomers with various molecular weights and compositions were prepared and characterized. These oligomers were cured at 300.degree. C. to 400.degree. C. to provide crosslinked polyimides with excellent solvent resistance, high strength and modulus and good high temperature properties. Adhesive panels, composites, films and moldings from these phenylethynyl terminated imide oligomers gave excellent mechanical performance.
四种苯乙炔胺化合物——3-氨基苯氧基-4'-苯乙炔基苯并酮和4-氨基苯氧基-4'-苯乙炔基苯并酮,以及3-氨基-4'-苯乙炔基苯并酮和4-氨基-4'-苯乙炔基苯并酮——可以轻松制备,并用于封端酰亚胺低聚物。制备和表征了具有不同分子量和组成的苯乙炔基末端酰胺酸低聚物和苯乙炔基末端酰亚胺低聚物。这些低聚物在300°C至400°C下固化,形成耐溶剂、高强度和模量以及良好高温性能的交联聚酰亚胺。使用这些苯乙炔基末端酰亚胺低聚物制备的粘接板、复合材料、薄膜和模塑品具有出色的机械性能。