(4-(dimethylamino)phenyl)(2-hydroxyphenyl)methanone | 118202-91-8

• 分子结构分类: 有机化合物 - 苯类化合物 - 苯和取代衍生物
• 英文名称: (4-(dimethylamino)phenyl)(2-hydroxyphenyl)methanone
• 英文别名: [4-(Dimethylamino)phenyl]-(2-hydroxyphenyl)methanone
• CAS: 118202-91-8
• 化学式: C₁₅H₁₅NO₂
• 分子量: 241.29
• InChiKey: ZXALUOPYEJPVTG-UHFFFAOYSA-N

物化性质

• 沸点：
  384.2±22.0 °C(Predicted)
• 密度：
  1.182±0.06 g/cm3(Predicted)

计算性质

• 辛醇/水分配系数(LogP)：
  3.6
• 重原子数：
  18
• 可旋转键数：
  3
• 环数：
  2.0
• sp3杂化的碳原子比例：
  0.13
• 拓扑面积：
  40.5
• 氢给体数：
  1
• 氢受体数：
  3

反应信息

• 作为产物：
  描述：

  2-[4-(二甲基氨基)苯甲酰基]苯甲酸 260.0 ℃ 、2.67 kPa 条件下， 生成 (4-(dimethylamino)phenyl)(2-hydroxyphenyl)methanone
  参考文献：
  名称：

  Limpricht; Seyler, Justus Liebigs Annalen der Chemie, 1899, vol. 307, p. 306

  摘要：

  DOI：

文献信息

• Integrating Metal-Catalyzed C–H and C–O Functionalization To Achieve Sterically Controlled Regioselectivity in Arene Acylation
  作者：Nicholas A. Serratore、Constance B. Anderson、Grant B. Frost、Truong-Giang Hoang、Steven J. Underwood、Philipp M. Gemmel、Melissa A. Hardy、Christopher J. Douglas

  DOI：10.1021/jacs.8b06476

  日期：2018.8.8

  organometallic chemists is the direct functionalization of the bonds most recurrent in organic molecules: C-H, C-C, C-O, and C-N. An even grander challenge is C-C bond formation when both precursors are of this category. Parallel to this is the synthetic goal of achieving reaction selectivity that contrasts with conventional methods. Electrophilic aromatic substitution (EAS) via Friedel-Crafts acylation

  有机金属化学家的一个主要目标是将有机分子中最常见的键直接官能化：CH、CC、CO 和 CN。当两种前体都属于此类时，更大的挑战是 CC 键的形成。与此并行的是实现与传统方法形成对比的反应选择性的合成目标。通过 Friedel-Crafts 酰化的亲电芳香取代 (EAS) 是合成芳基酮的最著名方法，芳基酮是许多药物、农用化学品、香料、染料和其他商品化学品的常见结构基序。然而，只有当所需的酰化位点与反应的电子控制区域选择性一致时，EAS 合成策略才有效。在此，我们报告了空间控制的区域选择性芳烃酰化与水杨酸酯通过铱催化获得明显取代的二苯甲酮。实验和计算数据表明，一种独特的反应机制将 CO 活化和 CH 活化与单一铱催化剂相结合，无需外源氧化剂或碱。我们公开了对芳烃和酯成分的合成范围的广泛探索，最终以简明的合成强效抗癌剂羟基苯司他汀。
• Undercoating composition for photolithographic resist
  申请人：TOKYO OHKA KOGYO CO., LTD.

  公开号：EP0803777A1

  公开（公告）日：1997-10-29

  Proposed is a novel undercoating composition to form an undercoating layer interposed between the surface of a substrate and a photoresist layer with an object to decrease the adverse influences by the reflection of light on the substrate surface in the pattern-wise exposure of the photoresist layer to ultraviolet light without the undesirable phenomena of intermixing between layers and notching along with a large selectivity ratio in the etching rates between the patterned resist layer and the undercoating layer in a dry-etching treatment. The undercoating composition comprises (A) an ultraviolet absorber which is a benzophenone compound or an aromatic azomethine compound each having at least one unsubstituted or alkyl-substituted amino group on the aryl groups and (B) a crosslinking agent which is preferably a melamine compound having at least two methylol groups or alkoxymethyl groups bonded to the nitrogen atoms in a molecule in a weight proportion (A):(B) in the range from 1:1 to 1:10.

  本发明提出了一种新颖的底涂层组合物，用于在基底表面和光刻胶层之间形成底涂层，目的是减少光刻胶层在紫外线下图案化曝光时基底表面光反射的不利影响，同时在干蚀刻处理中图案化抗蚀剂层和底涂层之间的蚀刻率具有较大的选择性比，而不会出现层间混杂和缺口等不良现象。底涂层组合物包括(A)紫外线吸收剂，它是二苯甲酮化合物或芳香族偶氮亚甲基化合物，每种化合物的芳基上至少有一个未取代或烷基取代的氨基；(B)交联剂，它最好是三聚氰胺化合物，分子中至少有两个甲醇基团或烷氧基甲基基团与氮原子键合，重量比例(A):(B)在 1:1 至 1:10 之间。
• ADHESIVE COMPOSITION FOR BONDING WATER AND SUPPORTING BODY FOR SAID WAFER, ADHESIVE FILM, AND LAMINATE
  申请人：Tokyo Ohka Kogyo Co., Ltd.

  公开号：EP2757136A1

  公开（公告）日：2014-07-23

  The adhesive composition for bonding a wafer and a support for the wafer according to the present invention contains an elastomer in which a styrene unit is contained as a constituent unit of a main chain, a content of the styrene unit is 14% by weight to 50% by weight, and a weight average molecular weight is 10,000 to 200,000.

  根据本发明，用于粘合晶片和晶片支撑物的粘合剂组合物含有一种弹性体，其中苯乙烯单元作为主链的组成单元，苯乙烯单元的含量为 14% 至 50%（按重量计），重量平均分子量为 10,000 至 200,000。
• Protective coating composition for dual damascene process
  申请人：——

  公开号：US20020077426A1

  公开（公告）日：2002-06-20

  The invention discloses a protective coating solution suitable for forming a resinous protective coating layer on a patterned resist layer in the manufacture of semiconductor devices having, in particular, crowdedly hole-patterned areas and areas of an isolated hole pattern. The essential ingredients of the solution are (A) a resinous compound such as an acrylic resin and (B) a crosslinking compound such as a triazine compound which are combined in such a proportion of 2:8 to 4:6 by weight that the overall weight-average molecular weight of the components (A) and (B) is in the range from 1300 to 4500. This inventive coating solution is advantageous in a respect of evenness in the thickness of the coating layer even on a patterned resist layer having a crowdedly hole-patterned area and an isolatedly hole-patterned area and absence of unfilled voids within the hole patterns.

  本发明公开了一种保护涂层溶液，适用于在制造特别是具有密集孔图案区域和孤立孔图案区域的半导体器件时，在图案抗蚀层上形成树脂保护涂层。该溶液的基本成分是：(A) 丙烯酸树脂等树脂化合物；(B) 三嗪化合物等交联化合物，二者的重量比例为 2:8 至 4:6，使(A)和(B)组分的总平均分子量在 1300 至 4500 之间。本发明的涂层解决方案的优点在于，即使在具有密集孔图案区域和孤立孔图案区域的图案抗蚀层上，涂层的厚度也很均匀，而且孔图案内没有未填充的空隙。
• METHOD USING AN ADHESIVE COMPOSITION FOR BONDING WAFER AND SUPPORTING BODY FOR SAID WAFER
  申请人：Tokyo Ohka Kogyo Co., Ltd.

  公开号：EP2757136B1

  公开（公告）日：2017-11-01