Copper-containing compositions can be provided in articles on a suitable substrate. Such compositions can include either reducible copper ions or copper nanoparticles complexed with a water-soluble reactive polymer or a water-insoluble crosslinked polymer derived from the water-soluble reactive polymer. The reactive polymer can be crosslinked using suitable irradiation to provide copper-containing water-insoluble complexes. The various articles and electrically -conductive materials can be assembled in electronic devices. The reactive polymer has greater than 1 mol % of recurring units comprising sulfonic acid or sulfonate groups, at least 5 mol % of recurring units comprising a pendant group capable of crosslinking via [2+2] photocycloaddition, and optionally at least 1 mol % of recurring units comprising a pendant amide, amine, hydroxy 1, lactam, phosphonic acid, or carboxylic acid group.
                            含
铜组分可以被提供在适合的基板上的物品中。这种组分可以包括可还原的
铜离子或与
水溶性活性聚合物或从
水溶性活性聚合物衍生的
水不溶性交联聚合物络合的
铜纳米粒子。活性聚合物可以通过适当的辐照进行交联,以提供含
铜的
水不溶性络合物。各种物品和电导材料可以组装在电子器件中。活性聚合物具有大于1摩尔%的重复单元,包括
磺酸或
磺酸盐基团,至少5摩尔%的重复单元,包括通过[2+2]光环加成能够交联的侧链基团,以及可选地至少1摩尔%的重复单元,包括侧链酰胺、胺、羟基、内酰胺、
膦酸或
羧酸基团。