申请人:Takeda Chemical Industries, Ltd.
公开号:EP0241027A2
公开(公告)日:1987-10-14
A method of profile lapping adhesion which comprises:
coating on a film or sheet, or a substrate, or both of these an adhesive composition which comprises:
(a) an epoxy resin or an isocyanate compound,
(b) a curing agent for the epoxy resin or the isocyanate compound, and
(c) a photopolymerizable vinyl compound;
irradiating the adhesive composition;
laminating the sheet or film to the substrate while the sheet or film is wrapped around the substrate; and
curing the adhesive composition.
An adhesive composition especially suitable for use in the profile lapping adhesion is provided, which comprises:
(a) a photopolymerizable compound which has a number average molecular weight of not less than about 3000 and at least one photopolymerizable double linkage in the molecule;
(b) a photopolymerizable monomer which has a molecular weight of about 200-800; and
(c) an isocyanate compound.
The photopolymerizable compound may be in part or in total displaced by a non-photopolymerizable compound which has a number average molecular weight of not less than about 5000.
The adhesive composition develops a large primary adhesive strength by being irradiated, and further the adhesive develops a strong adhesion by chemical cure of the isocyanate compound.
一种轮廓碾压粘合方法,包括
在薄膜或薄片或基材或两者上涂覆粘合剂组合物,该组合物包括
(a) 环氧树脂或异氰酸酯化合物、
(b) 环氧树脂或异氰酸酯化合物的固化剂,以及
(c) 可光聚合的乙烯基化合物;
照射粘合剂组合物;
在片材或薄膜包裹基材时,将片材或薄膜层压到基材上;以及
固化粘合剂组合物。
本发明提供了一种特别适用于型材碾压粘合的粘合剂组合物,它包括
(a) 可光聚合的化合物,其平均分子量不小于约 3000,分子中至少有一个可光聚合的双链;
(b) 可光聚合单体,其分子量约为 200-800;及
(c) 异氰酸酯化合物。
可光聚合化合物可部分或全部被平均分子量不小于约 5000 的不可光聚合化合物取代。
通过辐照,粘合剂组合物产生较大的初粘强度,通过异氰酸酯化合物的化学固化,粘合剂进一步产生较强的粘合力。