(E)-4-cyclopenta-1,3-dien-1-ylbut-2-enoic acid

• 分子结构分类: 有机化合物 - 脂质和类脂质分子 - 脂肪酰基
• 英文名称: (E)-4-cyclopenta-1,3-dien-1-ylbut-2-enoic acid
• 化学式: C₉H₁₀O₂
• 分子量: 150.17
• InChiKey: SCEVHMBCXOYJQJ-XVNBXDOJSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  1.7
• 重原子数：
  11
• 可旋转键数：
  3
• 环数：
  1.0
• sp3杂化的碳原子比例：
  0.22
• 拓扑面积：
  37.3
• 氢给体数：
  1
• 氢受体数：
  2

文献信息

• DIENE/DIENOPHILE COUPLES AND THERMOSETTING RESIN COMPOSITIONS HAVING REWORKABILITY
  申请人：Henkel IP & Holding GmbH

  公开号：US20160002510A1

  公开（公告）日：2016-01-07

  Thermosetting resin compositions are provided that are useful for mounting onto a circuit board semiconductor devices, such as chip size or chip scale packages (“CSPs”), ball grid arrays (“BGAs”), land grid arrays (“LGAs”) and the like (collectively, “subcomponents”), or semiconductor chips. Reaction products of the compositions are controllably reworkable when subjected to appropriate conditions.

  提供了热固性树脂组合物，可用于安装在电路板上的半导体器件，例如芯片尺寸或芯片规模封装（“CSP”），球栅阵列（“BGA”），陆地栅格阵列（“LGA”）等（统称为“子组件”），或半导体芯片。当受到适当条件的影响时，该组合物的反应产物可被可控地重做。
• Diene/dienophile couples and thermosetting resin compositions having reworkability
  申请人：Henkel IP & Holding GmbH

  公开号：US10472548B2

  公开（公告）日：2019-11-12

  Thermosetting resin compositions are provided that are useful for mounting onto a circuit board semiconductor devices, such as chip size or chip scale packages (“CSPs”), ball grid arrays (“BGAs”), land grid arrays (“LGAs”) and the like (collectively, “subcomponents”), or semiconductor chips. Reaction products of the compositions are controllably reworkable when subjected to appropriate conditions.

  本发明提供的热固性树脂组合物适用于在电路板上安装半导体器件，如芯片尺寸或芯片级封装（"CSP"）、球栅阵列（"BGA"）、陆栅阵列（"LGA"）等（统称为 "子组件"）或半导体芯片。组合物的反应产物在适当的条件下可进行可控的再加工。
• US9938437B2
  申请人：——

  公开号：US9938437B2

  公开（公告）日：2018-04-10
• [EN] DIENE/DIENOPHILE COUPLES AND THERMOSETTING RESIN COMPOSITIONS HAVING REWORKABILITY<br/>[FR] COUPLES DIÈNE/DIÉNOPHILE ET COMPOSITIONS DE RÉSINE THERMODURCISSABLE PRÉSENTANT UNE RETRAITABILITÉ
  申请人：HENKEL IP & HOLDING GMBH

  公开号：WO2014153513A1

  公开（公告）日：2014-09-25

  Thermosetting resin compositions are provided that are useful for mounting onto a circuit board semiconductor devices, such as chip size or chip scale packages ("CSPs"), ball grid arrays ("BGAs"), land grid arrays ("LGAs") and the like (collectively, "subcomponents"), or semiconductor chips. Reaction products of the compositions are controllably reworkable when subjected to appropriate conditions.