Ethene;2-methylprop-2-enamide

• 分子结构分类: 有机化合物 - 有机酸及其衍生物 - 羧酸及其衍生物
• 英文名称: Ethene;2-methylprop-2-enamide
• 英文别名: ethene;2-methylprop-2-enamide
• 化学式: C6H11NO
• 分子量: 113.16
• InChiKey: KKDPQPQKRMKLKD-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  0.85
• 重原子数：
  8
• 可旋转键数：
  1
• 环数：
  0.0
• sp3杂化的碳原子比例：
  0.17
• 拓扑面积：
  43.1
• 氢给体数：
  1
• 氢受体数：
  1

文献信息

• Re-workable moisture curable hot melt adhesive composition, methods of using the same, and articles including the same
  申请人：H.B. Fuller Company

  公开号：US10011749B2

  公开（公告）日：2018-07-03

  Disclosed is an article that includes a first substrate, a second substrate, and a re-workable adhesive composition, the first substrate being bonded to the second substrate through the adhesive composition. The adhesive composition is derived from a moisture curable polyurethane hot melt adhesive composition that includes a polyurethane prepolymer that includes the reaction product of a first crystalline polyester polyol having a number average molecular weight of from at least 5500 grams per mole (g/mol) to about 20,000 g/mol and a melting point of at least 40° C., and a polyisocyanate. The re-workable adhesive composition is cleanly removable from at least one of the first substrate and the second substrate after conditioning the article at a temperature of from at least 60° C. to no greater than 100° C. for a period of about 30 minutes.

  公开了一种物品，它包括第一基材、第二基材和可再加工的粘合剂组合物，第一基材通过粘合剂组合物粘合到第二基材上。该粘合剂组合物来自一种可湿气固化的聚氨酯热熔粘合剂组合物，该组合物包括一种聚氨酯预聚物，该预聚物包括一种第一结晶聚酯多元醇的反应产物，该第一结晶聚酯多元醇的平均分子量至少为 5500 克/摩尔（g/mol）至约 20000 克/摩尔，熔点至少为 40 摄氏度，还包括一种多异氰酸酯。在至少 60 摄氏度至不高于 100 摄氏度的温度下对物品进行约 30 分钟的调节后，可再加工粘合剂组合物可从第一基底和第二基底中的至少一个基底上干净地去除。
• RE-WORKABLE MOISTURE CURABLE HOT MELT ADHESIVE COMPOSITION METHODS OF USING THE SAME, AND ARTICLES INCLUDING THE SAME
  申请人：H. B. Fuller Company

  公开号：EP3180376A1

  公开（公告）日：2017-06-21
• RE-WORKABLE MOISTURE CURABLE HOT MELT ADHESIVE COMPOSITION, METHODS OF USING THE SAME, AND ARTICLES INCLUDING THE SAME
  申请人：H.B. Fuller Company

  公开号：US20160046845A1

  公开（公告）日：2016-02-18

  Disclosed is an article that includes a first substrate, a second substrate, and a re-workable adhesive composition, the first substrate being bonded to the second substrate through the adhesive composition. The adhesive composition is derived from a moisture curable polyurethane hot melt adhesive composition that includes a polyurethane prepolymer that includes the reaction product of a first crystalline polyester polyol having a number average molecular weight of from at least 5500 grams per mole (g/mol) to about 20,000 g/mol and a melting point of at least 40° C., and a polyisocyanate. The re-workable adhesive composition is cleanly removable from at least one of the first substrate and the second substrate after conditioning the article at a temperature of from at least 60° C. to no greater than 100° C. for a period of about 30 minutes.
• OILY CHEMICAL RESISTANT ARTICLES AND OILY CHEMICAL RESISTANT MOISTURE CURABLE HOT MELT ADHESIVE COMPOSITIONS
  申请人：H.B. Fuller Company

  公开号：US20160251552A1

  公开（公告）日：2016-09-01

  Disclosed is an electronic article that includes a first substrate, a moisture cured polyurethane hot melt adhesive composition, a second substrate bonded to the first substrate through the cured adhesive composition, and an electrically conductive element, the cured adhesive composition being derived from at least 15% by weight amorphous polyester polyol having a number average molecular weight of from about 500 grams per mole to about 10,000 grams per mole and a glass transition temperature no greater than 0° C., and including aromatic units, at least 15% by weight crystalline polyester polyol having a glass transition temperature of no greater than 20° C., a melting point of from about 40° C. to about 120° C., and a number average molecular weight of from about 2000 grams per mole to about 20,000 grams per mole, and polyisocyanate. Prior to cure, the adhesive composition exhibits a viscosity no greater than 10,000 centipoise at 120° C.
• OILY CHEMICAL RESISTANT MOISTURE CURABLE HOT MELT ADHESIVE COMPOSITIONS AND ARTICLES INCLUDING THE SAME
  申请人：H.B. Fuller Company

  公开号：US20180237671A1

  公开（公告）日：2018-08-23

  Disclosed is a moisture curable hot melt adhesive composition that includes a polyurethane prepolymer that includes the reaction product of an amorphous polyester polyol having a solubility parameter of at least 9.8 (cal/cm 3 ) 1/2 and a glass transition temperature no greater than 25° C., at least 10% by weight of a crystalline polyester polyol having a melting point of at least 75° C., and polyisocyanate.