申请人:Zhen Ding Technology Co., Ltd.
公开号:US20180201805A1
公开(公告)日:2018-07-19
A resin composition comprises a modified polyimide compound, an epoxy resin, and a solvent. The modified polyimide compound has a chemical structural formula of
the Ar′ represents a group selected from a group consisting of phenyl having a chemical structural formula of
diphenyl ether having a chemical structural formula of
biphenyl having a chemical structural formula
hexafluoro-2,2-diphenylpropane having a chemical structural formula of
benzophenone having a chemical structural formula of
and diphenyl sulfone having a chemical structural formula of
and any combination thereof, the epoxy resin and the modified polyimide compound are in a molar ratio of about 0.1:1 to about 1:1. A polyimide film and a method for manufacturing the polyimide film using the resin composition are also provided.