2-[(E)-2-(4-methoxyphenyl)ethenyl]-1H-imidazole

• 分子结构分类: 有机化合物 - 苯类化合物 - 苯酚醚
• 英文名称: 2-[(E)-2-(4-methoxyphenyl)ethenyl]-1H-imidazole
• 化学式: C₁₂H₁₂N₂O
• 分子量: 200.24
• InChiKey: YAXVEVGFPVWPKA-QPJJXVBHSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  2.3
• 重原子数：
  15
• 可旋转键数：
  3
• 环数：
  2.0
• sp3杂化的碳原子比例：
  0.08
• 拓扑面积：
  37.9
• 氢给体数：
  1
• 氢受体数：
  2

文献信息

• Reworkable thermosetting resin composition
  申请人：Klemarczyk Philip T.

  公开号：US20080214840A1

  公开（公告）日：2008-09-04

  This invention relates to thermosetting resin compositions useful for mounting onto a circuit board semiconductor devices, such as CSPs, BGAs, LGAs and the like, each of which having a semiconductor chip, such as LSI, on a carrier substrate. The compositions of this invention are reworkable when subjected to appropriate conditions.

  这项发明涉及热固性树脂组合物，适用于安装在电路板上的半导体器件，如CSPs、BGAs、LGAs等，每个器件都有一个半导体芯片，如LSI，安装在载体基板上。本发明的组合物在适当条件下可重复加工。
• Reworkable epoxidized 1-(cyclo) alkenyl ether/polycarboxylic acid product
  申请人：——

  公开号：US20040102544A1

  公开（公告）日：2004-05-27

  The present invention discloses reworkable epoxy compositions suitable for encapsulation of and underfill for electronic components comprising (a) a curable epoxy component which is the reaction product of an epoxidized 1-alkenyl ether or 1-cycloalkenyl ether and a polycarboxylic acid, the reaction product being substantially free of unreacted acid or acid impurities; and (b) a curing agent for the epoxy component, wherein the reaction products of the epoxy composition are reworkable. The cured epoxy compositions of this invention contain thermally labile weak &agr;-alkoxy ester linkages which provide for the reworkable aspect of the invention.

  本发明揭示了适用于电子元件封装和下填的可重复加工环氧组合物，包括（a）可固化的环氧组分，其是环氧化的1-烯基醚或1-环烯基醚和多羧酸的反应产物，反应产物基本上不含未反应的酸或酸杂质；以及（b）用于环氧组分的固化剂，其中环氧组合物的反应产物是可重复加工的。本发明的固化环氧组合物包含热不稳定的弱α-烷氧酯键，这提供了本发明可重复加工的方面。
• Reworkable compositions of oxirane(s) or thirane(s)-containing resin and curing agent
  申请人：——

  公开号：US20030073770A1

  公开（公告）日：2003-04-17

  This invention relates to thermosetting resin compositions useful for mounting onto a circuit board semiconductor devices, such as CSPs, BGAs, LGAs and the like, each of which having a semiconductor chip, such as LSI, on a carrier substrate. The compositions of this invention are reworkable when subjected to appropriate conditions.

  本发明涉及热固性树脂组合物，可用于将半导体器件（如CSP、BGA、LGA等）安装在电路板上，每个器件都有一个载体基板上的半导体芯片（如LSI）。本发明的组合物在适当条件下可进行重复加工。
• Co-curable compositions
  申请人：Liu Puwei

  公开号：US20050288457A1

  公开（公告）日：2005-12-29

  The present invention provides co-curable compositions in which an anionically or cationically reactive component, such as an epoxy or episulfide resin component; a free-radical polymerizable component; and a cross linking component, where the cross linking component is reactive with each of the anionically or cationically reactive component and the free radical polymerizable component through functionalization with at least one group reactive through an anionic or cationic mechanism and at least one group reactive through a free radical mechanism. The invention further provides methods of preparing such compositions, methods of applying such compositions to substrate surfaces, and assemblies prepared therewith for connecting microelectronic circuitry.

  本发明提供了共固化组合物，其中包括阴离子或阳离子反应组分，例如环氧或环硫醚树脂组分；自由基可聚合组分；以及交联组分，其中交联组分通过至少一种通过阴离子或阳离子机制反应的基团和至少一种通过自由基机制反应的基团进行官能化，与阴离子或阳离子反应组分和自由基可聚合组分反应。本发明还提供了制备这种组合物的方法，将这种组合物应用于基底表面的方法，以及用于连接微电子电路的组件。
• Foamable compositions
  申请人：HENKEL LOCTITE CORPORATION

  公开号：US20040063800A1

  公开（公告）日：2004-04-01

  This invention relates to latent foamable compositions for use in or as adhesives, sealants and/or coatings. The compositions include a curable component or a thermoplastic component, together with a latent foaming agent. In curable versions of the inventive compositions, a cure initiator or catalyst may also be included.

  本发明涉及用于粘合剂、密封剂和/或涂料的潜伏性发泡组合物。该组合物包括可固化组分或热塑性组分，以及潜伏性发泡剂。在本发明组合物的可固化版本中，还可以包括固化引发剂或催化剂。