申请人:CHOU MENG-YEN
公开号:US20100086871A1
公开(公告)日:2010-04-08
The invention pertains to an epoxy-modified photosensitive polyimide, which possesses excellent heat resistance, chemistry resistance, and flexibility, and can be used in a liquid photo resist or dry film resist, or used in a solder resist, coverlay film, or printed circuit board.