1-Propanesulfonic acid, 3-[[(dimethylamino)thioxomethyl]thio]- | 68901-20-2

• 分子结构分类: 有机化合物 - 有机酸及其衍生物 - 有机磺酸及其衍生物
• 英文名称: 1-Propanesulfonic acid, 3-[[(dimethylamino)thioxomethyl]thio]-
• 英文别名: 3-(dimethylcarbamothioylsulfanyl)propane-1-sulfonic acid
• CAS: 68901-20-2
• 化学式: C₆H₁₃NO₃S₃
• 分子量: 243.4
• InChiKey: WRBSVISDQAINGQ-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  0.5
• 重原子数：
  13
• 可旋转键数：
  5
• 环数：
  0.0
• sp3杂化的碳原子比例：
  0.83
• 拓扑面积：
  123
• 氢给体数：
  1
• 氢受体数：
  5

文献信息

• [EN] POLYMERS CONTAINING BENZIMIDAZOLE MOIETIES AS LEVELERS<br/>[FR] POLYMÈRES CONTENANT DES FRAGMENTS BENZIMIDAZOLE COMME AGENTS D'UNISSON
  申请人：ROHM & HAAS ELECT MAT

  公开号：WO2015074190A1

  公开（公告）日：2015-05-28

  Polymers of reaction products of dihalogens and compounds containing benzimidazole moieties are included in metal electroplating compositions to provide level metal deposits on substrates.

  将含有二卤代物和含有苯并咪唑基团的化合物的反应产物的聚合物包含在金属电镀组合物中，可在基板上提供平坦的金属沉积。
• POLYMERS CONTAINING BENZIMIDAZOLE MOIETIES AS LEVELERS
  申请人：ROHM AND HAAS ELECTRONIC MATERIALS LLC

  公开号：US20160255729A1

  公开（公告）日：2016-09-01

  Polymers of reaction products of dihalogens and compounds containing benzimidazole moieties are included in metal electroplating compositions to provide level metal deposits on substrates.

  含有苯并咪唑基团的化合物和二卤代物反应产物的聚合物被包含在金属电镀组合物中，以在基板上提供平坦的金属沉积物。
• Leveler compound for copper plating baths
  申请人：Shipley Co. L.L.C.

  公开号：EP1371757A1

  公开（公告）日：2003-12-17

  Compounds that function to provide level or uniform metal deposits are provided. These compounds are particularly useful in providing level copper deposits. Copper plating baths and methods of copper plating using these compounds are also provided. These baths and methods are useful for providing a planarized layer of copper on a substrate having small apertures. The compositions and methods provide complete fill of small apertures with reduced void formation.

  提供的化合物具有提供平整或均匀金属沉积物的功能。这些化合物尤其适用于提供平整的铜镀层。此外，还提供了使用这些化合物的镀铜液和镀铜方法。这些镀铜液和镀铜方法适用于在具有小孔的基底上形成平面铜层。这些组合物和方法可完全填充小孔，减少空隙的形成。
• Copper electropating bath and method
  申请人：Rohm and Haas Electronic Materials LLC

  公开号：EP2366692A2

  公开（公告）日：2011-09-21

  Copper plating baths containing a leveling agent that is a reaction product of a certain imidazole with a certain epoxide-containing compound that deposit copper on the surface of a conductive layer are provided. Such plating baths deposit a copper layer that is substantially planar on a substrate surface across a range of electrolyte concentrations. Methods of depositing copper layers using such copper plating baths are also disclosed.

  本发明提供了含有一种整平剂的镀铜液，该整平剂是某种咪唑与某种含环氧化物化合物的反应产物，可在导电层表面沉积铜。这种电镀液可以在一定的电解液浓度范围内，在基底表面沉积出基本上是平面的铜层。此外，还公开了使用这种镀铜液沉积铜层的方法。
• Electroplating bath
  申请人：Rohm and Haas Electronic Materials LLC

  公开号：EP2770087A1

  公开（公告）日：2014-08-27

  Compositions suitable for the electrodeposition of copper on substrates, such as electronic device substrates, are provided. Methods of depositing copper layers on surfaces and filling apertures with copper are also provided.

  提供了适用于在基底（如电子设备基底）上电沉积铜的组合物。此外，还提供了在表面上沉积铜层和用铜填充孔隙的方法。