1H-Imidazolium, 1-(carboxymethyl)-2-heptyl-4,5-dihydro-1-(2-hydroxyethyl)-, inner salt | 68171-60-8

• 分子结构分类: 有机化合物 - 有机酸及其衍生物 - 羧酸及其衍生物
• 英文名称: 1H-Imidazolium, 1-(carboxymethyl)-2-heptyl-4,5-dihydro-1-(2-hydroxyethyl)-, inner salt
• 英文别名: 2-[2-heptyl-1-(2-hydroxyethyl)-4,5-dihydroimidazol-1-ium-1-yl]acetate
• CAS: 68171-60-8
• 化学式: C14H26N2O3
• 分子量: 270.37
• InChiKey: IGYYYMBAPCNKSD-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  2.3
• 重原子数：
  19
• 可旋转键数：
  9
• 环数：
  1.0
• sp3杂化的碳原子比例：
  0.86
• 拓扑面积：
  72.7
• 氢给体数：
  1
• 氢受体数：
  4

文献信息

• ELECTROLESS PLATING METHOD
  申请人：Rohm and Haas Electronic Materials LLC

  公开号：US20180179633A1

  公开（公告）日：2018-06-28

  A method of the present invention for performing an electroless plating on a substrate comprising the steps of: (a) putting the substrate in contact with a composition containing a compound represented by the following general formula (1): wherein R 1 is an alkyl group having 8 to 20 carbon atoms or an aryl group having 5 to 14 carbon atoms, the alkyl group or the aryl group may be substituted by a hydroxyl group, a carboxyl group, a halogen or an alkyl group having 1 to 4 carbon atoms. R 2 , R 3 , and R 4 are each independently a hydrogen atom or an alkyl group having 1 to 4 carbon atoms, the alkyl group may be substituted by a hydroxyl group, a carboxyl group or a halogen, wherein at least one of R 2 , R 3 , and R 4 may be bonded with R 1 to form a ring, X is a counter anion); (b) putting the substrate in contact with a catalyst composition, and (c) putting the substrate in contact with an electroless plating composition.