1,3,5-Triazine-2,4,6-tris(2-hydroxyethyl)tris(methacrylate) | 68845-21-6

• 分子结构分类: 有机化合物 - 有机酸及其衍生物 - 羧酸及其衍生物
• 英文名称: 1,3,5-Triazine-2,4,6-tris(2-hydroxyethyl)tris(methacrylate)
• 英文别名: 2-[4,6-bis[2-(2-methylprop-2-enoyloxy)ethyl]-1,3,5-triazin-2-yl]ethyl 2-methylprop-2-enoate
• CAS: 68845-21-6
• 化学式: C₂₁H₂₇N₃O₆
• 分子量: 417.5
• InChiKey: AGEXUCKZTAUZJM-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  3.4
• 重原子数：
  30
• 可旋转键数：
  15
• 环数：
  1.0
• sp3杂化的碳原子比例：
  0.43
• 拓扑面积：
  118
• 氢给体数：
  0
• 氢受体数：
  9

文献信息

• PROCESS FOR PRODUCTION OF CURED MOLDED ARTICLE, AND CURED MOLDED ARTICLE
  申请人：Nippon Shokubai Co., Ltd.

  公开号：EP2479209A1

  公开（公告）日：2012-07-25

  Provided is a process for production of a cured molded article capable of readily producing a transparent and discoloration-free cured molded article that exhibits a low shrinkage ratio and an excellent heat resistance, abrasion resistance, and mold release behavior. Also provided is a cured molded article that is useful in a variety of applications, for example, as an optical member. The process for production of a cured molded article from a curable resin composition that comprises a condensable inorganic compound, a curable organic compound, and a curing agent is a process for production of a cured molded article including a first step composed of a step of thermally curing the curable resin composition at 80 to 200°C and/or a step of curing the curable resin composition by exposure to active-energy radiation, and a second step of subjecting the cured material obtained in the first step to a thermal cure at above 200°C but not more than 500°C.

  本发明提供了一种固化成型品的生产工艺，该工艺能够轻松生产出透明且无变色的固化成型品，该成型品具有较低的收缩率和出色的耐热性、耐磨性和脱模性。此外，还提供了一种固化成型品，可用于多种用途，例如光学部件。由可凝结无机化合物、可固化有机化合物和固化剂组成的可固化树脂组合物生产固化成型品的工艺是一种生产固化成型品的工艺，包括第一步，在 80 至 200°C 的温度下对可固化树脂组合物进行热固化和/或通过暴露于活性能量辐射对可固化树脂组合物进行固化；第二步，将第一步中获得的固化材料在 200°C 以上但不超过 500°C 的温度下进行热固化。
• Photosensitive resin composition
  申请人：Otsuki Nobuaki

  公开号：US20070112106A1

  公开（公告）日：2007-05-17

  To provide a photosensitive resin composition satisfying both of the sensitivity at the time of exposure and alkali developability as well as giving a cured material excellent in dimensions stability and scarcely exhibiting brittleness while keeping good heat resistance. The photosensitive resin composition contains a polymer (A) having an N-substituted maleimide group, a carboxyl group, and an ethylenic unsaturated double bond at a ratio less than 0.05 moles per 100 parts by mass of the polymer.
• SOLDER RESIST, DRY FILM THEREOF, CURED PRODUCT, AND PRINTED WIRING BOARD
  申请人：Otsuki Nobuaki

  公开号：US20100243304A1

  公开（公告）日：2010-09-30

  A solder resist having both adequate sensitivity at photo-irradiation and alkali developability, and the solder resist forming a cured product which is excellent in dimensional stability against temperature change, does not exhibit brittleness, and further, is excellent in water resistance, electrical insulation, thermal cycle test resistance (TCT resistance) and the like is provided, and further, a dry film having a solder resist layer, a cured product and a printed wiring board are provided. The solder resist comprising an acid-modified vinyl ester synthesized from an epoxy compound, a phenol compound, an unsaturated monobasic acid and a polybasic acid anhydride, wherein the epoxy compound contains a crystalline epoxy resin having a melting point of 90° C. or more, and the phenol compound contains a compound having a bisphenol S structure.
• US8722816B2
  申请人：——

  公开号：US8722816B2

  公开（公告）日：2014-05-13