1,2,4-Benzenetricarboxylic acid, ester with 1,2-ethanediol | 71342-70-6

• 分子结构分类: 有机化合物 - 有机酸及其衍生物 - 羧酸及其衍生物
• 英文名称: 1,2,4-Benzenetricarboxylic acid, ester with 1,2-ethanediol
• 英文别名: benzene-1,2,4-tricarboxylic acid;ethane-1,2-diol
• CAS: 71342-70-6
• 化学式: C11H12O8
• 分子量: 272.21
• InChiKey: PPSWQKPMZQIJJZ-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  -0.25
• 重原子数：
  19
• 可旋转键数：
  4
• 环数：
  1.0
• sp3杂化的碳原子比例：
  0.18
• 拓扑面积：
  152
• 氢给体数：
  5
• 氢受体数：
  8

文献信息

• LACTIC ACID POLYMER COMPOSITION AND MOLDED OBJECT THEREOF
  申请人：NEW JAPAN CHEMICAL CO.,LTD.

  公开号：EP1454958A1

  公开（公告）日：2004-09-08

  Disclosed herein are a lactic acid-based polymer composition comprising: (i) an amide compound represented by General Formula (1): wherein R1 represents a C2-30 saturated or unsaturated aliphatic polycarboxylic acid residue, a C4-28 saturated or unsaturated alicyclic polycarboxylic acid residue, or a C6-28 aromatic polycarboxylic acid residue, and R2 represents C1-18 alkyl, C2-18 alkenyl, C3-12 cycloalkyl or cycloalkenyl or the like, (ii) an ester plasticizer, and (iii) a lactic acid-based polymer; a transparent, crystalline (heat resistant) molded article molded from such a lactic acid-based polymer composition; and a method for producing such a molded article.

  本文公开了一种乳酸基聚合物组合物，该组合物包含：(i) 通式(1)代表的酰胺化合物： 其中 R1 代表 C2-30 饱和或不饱和脂肪族多羧酸残基、C4-28 饱和或不饱和脂环族多羧酸残基或 C6-28 芳香族多羧酸残基，R2 代表 C1-18 烷基、C2-18 烯基、C3-12 环烷基或环烯基或类似物，(ii) 酯增塑剂，以及 (iii) 乳酸基聚合物；用这种乳酸基聚合物组合物模制的透明结晶（耐热）模制件；以及生产这种模制件的方法。
• IGNITER AND GAS GENERATOR HAVING THE SAME
  申请人：NIPPON KAYAKU KABUSHIKI KAISHA

  公开号：EP1757897A1

  公开（公告）日：2007-02-28

  Provided is a squib for attaining a normal ignition of gas generants even when an adhesion state of the plug with enhancers is released by vibration or impact and a gas generator having the squib. A squib including a plug 13, two or more electrode pins 14 which pass through the plug 13 and respectively provided with a head 25, a bridge wire 16 connecting spaces between the respective heads 25 on at least two electrode pins 14 among the electrode pins 14, and ignition charge 10 which are ignited by the bridge wire 16 electrified via the electrode pins 14, wherein the plug 13 is a cured composition of thermosetting resins, the electrode pin 14 in which the bridge wire 16 is connected to the head 25 passes through the plug 13, with a predetermined distance A kept between the head 25 and the plug 13, and at least the head 25 and the bridge wire 16 are enclosed by the ignition charge 10, which is a solid, and fixed to the plug 13.

  本发明提供了一种即使在塞子与增强剂的粘附状态因振动或撞击而释放的情况下仍能实现气体发生器正常点火的压块，以及一种具有该压块的气体发生器。包括一个插头 13、两个或两个以上穿过插头 13 并分别设有头部 25 的电极插针 14、连接电极插针 14 中至少两个电极插针 14 上各自头部 25 之间空间的桥丝 16 以及通过电极插针 14 通电的桥丝 16 点燃的点火电荷 10、其中，插头13是热固性树脂的固化组合物，连接桥丝16和头部25的电极针14穿过插头13，头部25和插头13之间保持预定距离A，至少头部25和桥丝16被点火装料10包围，点火装料10是固体，固定在插头13上。
• Polyimide copolymer and methods for preparing the same
  申请人：——

  公开号：US20040010062A1

  公开（公告）日：2004-01-15

  The present invention relates to a polyimide copolymer used in a precursor of heat resistant adhesive and methods for preparing the same, and more particularly, to a polyamic acid copolymer and methods for preparing the same obtained by controlling a polymerization degree of the tetracarboxylic acid dianhydride and aromatic diamine. The present invention also comprises a polyimide copolymer obtained by curing the polyamic acid copolymer, and methods for preparing the same. The present invention also provides a heat resistant adhesive composition comprising the polyamic acid copolymer and the polyimide copolymer, and a semiconductor device using the same. The polyamic acid copolymer used in a precursor and polyimide copolymer obtained therefrom of the present invention has superior adhesion strength and simultaneously satisfies physical properties like high heat resistance and low water absorption rate, etc. and thus it can be effectively adhered parts of semiconductor devices, etc.

  本发明涉及一种用于耐热粘合剂前体的聚酰亚胺共聚物及其制备方法，更具体地说，涉及一种通过控制四羧酸二酐和芳香族二胺的聚合度而获得的聚酰胺共聚物及其制备方法。本发明还包括一种通过固化聚酰胺共聚物而获得的聚酰亚胺共聚物，以及制备该共聚物的方法。本发明还提供了一种由聚酰胺共聚物和聚酰亚胺共聚物组成的耐热粘合剂组合物，以及使用该组合物的半导体器件。本发明的前体中使用的聚酰胺共聚物和由此获得的聚酰亚胺共聚物具有优异的粘合强度，同时满足高耐热性和低吸水率等物理性能，因此可以有效地粘合半导体设备等的部件。
• IMIDE CONTAINING POLYMERS MADE BY BULK POLYMERIZATION
  申请人：Sumitomo Bakelite Company Limited

  公开号：EP1141092A1

  公开（公告）日：2001-10-10
• EP1448669A4
  申请人：——

  公开号：EP1448669A4

  公开（公告）日：2005-01-19