The present application relates to an immunostimulatory compound comprising an immunostimulant portion and a peptide portion. The peptide portion is not a disease-associated immunogen. Furthermore, the peptide portion has an amino acid sequence in which 75% or less of the amino acid residues are hydrophobic and/or has an isoelectric point of 5 or greater. The compounds of the invention address the problem of systemic distribution of immunostimulants causing unwanted side effects. The inventors have found that the physicochemical properties of the immunostimulant can be controlled by covalent linkage to a peptide. Further physicochemical properties may be modified in a useful manner by incorporating additional features.
本申请涉及一种免疫刺激化合物,包括免疫刺激剂部分和
多肽部分。肽部分不是与疾病相关的免疫原。此外,肽部分的
氨基酸序列中 75% 或更少的
氨基酸残基是疏
水的,和/或等电点为 5 或更高。本发明的化合物解决了免疫刺激剂的全身分布会导致不必要的副作用的问题。本发明者发现,免疫刺激剂的理化性质可以通过与肽的共价连接来控制。此外,还可以通过加入其他特征,以有用的方式改变免疫刺激剂的理化性质。