A method for manufacturing an electronic device includes at least a preparing step of preparing a structure (100) provided with an adhesive film (50) provided with a base material layer (10), an adhesive resin layer (A) provided on a first surface (10A) side of the base material layer (10) and used for temporarily fixing an electronic component (70), an adhesive resin layer (B) provided on a second surface (10B) side of the base material layer (10) and in which an adhesive force is reduced by external stimuli, and an unevenness-absorbing resin layer (C) provided between the base material layer (10) and the adhesive resin layer (A) or between the base material layer (10) and the adhesive resin layer (B), an electronic component (70) attached to the adhesive resin layer (A) of the adhesive film (50) and having an uneven structure (75), and a support substrate (80) attached to the adhesive resin layer (B) of the adhesive film (50) ; and a sealing step of sealing the electronic component (70) with a sealing material (60).
一种制造电子设备的方法至少包括一个准备步骤,即准备一个结构(100),该结构具有一个粘合膜(50),该粘合膜具有一个基底材料层(10)、一个粘合
树脂层(A),该粘合
树脂层(A)设置在基底材料层(10)的第一表面(10A)侧,用于临时固定电子元件(70)、一个粘合
树脂层(B),该粘合
树脂层(B)设置在基底材料层(10)的第二表面(10B)侧,其中粘合力通过外部刺激而降低、在基底材料层(10)和粘合剂
树脂层(A)之间或基底材料层(10)和粘合剂
树脂层(B)之间设置的凹凸吸收
树脂层(C),附着在粘合膜(50)的粘合剂
树脂层(A)上且具有凹凸结构(75)的电子元件(70),以及附着在粘合膜(50)的粘合剂
树脂层(B)上的支撑基板(80);以及用密封材料 (60) 密封电子元件 (70) 的密封步骤。