Tetramethylammonium sorbate | 72138-90-0

• 分子结构分类: 有机化合物 - 脂质和类脂质分子 - 脂肪酰基
• 英文名称: Tetramethylammonium sorbate
• 英文别名: (2E,4E)-hexa-2,4-dienoate;tetramethylazanium
• CAS: 72138-90-0
• 化学式: C10H19NO2
• 分子量: 185.26
• InChiKey: NIEOQTZTGJGHKV-STWYSWDKSA-M

计算性质

• 辛醇/水分配系数(LogP)：
  0.19
• 重原子数：
  13
• 可旋转键数：
  1
• 环数：
  0.0
• sp3杂化的碳原子比例：
  0.5
• 拓扑面积：
  40.1
• 氢给体数：
  0
• 氢受体数：
  2

文献信息

• CMP cleaning composition with microbial inhibitor
  申请人：——

  公开号：US20030089891A1

  公开（公告）日：2003-05-15

  An antimicrobial cleaning composition and methods for cleaning semiconductor substrates, particularly after chemical mechanical planarization or polishing, are provided. In one embodiment, the cleaning composition combines a solvent, a cleaning agent such as a hydroxycarboxylic acid or salt thereof, and at least one antimicrobial agent resulting in a cleaning composition in which microbial growth is inhibited. Examples of suitable antimicrobial agents include a benzoic acid or salt such as potassium or ammonium benzoate, and sorbic acid or salt such as potassium sorbate. The composition is useful for cleaning a wafer and particularly for removing residual particles after a conductive layer has been planarized to a dielectric layer under the conductive layer in a chemical mechanical planarization of a semiconductor wafer with abrasive slurry particles, particularly after a CMP of copper or aluminum films. Use of the cleaning composition advantageously inhibits microbial growth in the cleaning solution and deposition on the cleaned planarized surface.

  本发明提供了一种抗菌清洁组合物和清洁半导体基底的方法，特别是在化学机械平面化或抛光之后。在一个实施方案中，清洗组合物将溶剂、清洗剂（如羟基羧酸或其盐）和至少一种抗菌剂结合在一起，形成一种抑制微生物生长的清洗组合物。合适的抗菌剂包括苯甲酸或其盐，如苯甲酸钾或苯甲酸铵，以及山梨酸或其盐，如山梨酸钾。该组合物可用于清洁晶片，特别是在用研磨浆颗粒对半导体晶片进行化学机械平坦化时，尤其是在对铜或铝薄膜进行 CMP 后，将导电层与导电层下的介电层平坦化后，清除残留颗粒。使用这种清洁组合物可以有效抑制清洁溶液中微生物的生长以及在清洁后的平面化表面上的沉积。
• FABRIC DETERGENT FORMULATION
  申请人：Celanese International Corporation

  公开号：EP4103675A1

  公开（公告）日：2022-12-21
• Fabric Detergent Formulation
  申请人：Celanese International Corporation

  公开号：US20210246398A1

  公开（公告）日：2021-08-12

  A fabric detergent formulation is provided. The formulation comprises a preservative system that includes one or more sorbates in an amount of from about 0.01 wt. % to about 0.8 wt. % of the fabric detergent formulation; one or more anionic surfactants, wherein the weight ratio of the anionic surfactants to the sorbates is about 10 or more; and a solvent system that includes water in an amount of from about 50 wt. % to 100 wt. % of the fabric detergent formulation. The pH of the fabric detergent formulation is about 6.5 or more.
• US7235494B2
  申请人：——

  公开号：US7235494B2

  公开（公告）日：2007-06-26
• US7468105B2
  申请人：——

  公开号：US7468105B2

  公开（公告）日：2008-12-23