PHOTOSENSITIVE RESIN COMPOSITION, POLYAMIDE RESIN, METHOD FOR PRODUCING POLYAMIDE RESIN, COMPOUND, METHOD FOR PRODUCING COMPOUND, METHOD FOR PRODUCING CURED FILM, AND CURED FILM
申请人:TOKYO OHKA KOGYO CO., LTD.
公开号:US20180107114A1
公开(公告)日:2018-04-19
A photosensitive resin composition capable of forming a cured film with satisfactory adhesion to substrates and excellent transparency, a polyamide resin which is used in the photosensitive resin composition, a method for producing the polyamide resin, a compound which is used as a raw material of the polyamide resin, a method for producing the compound, a method for producing a cured film using the photosensitive resin composition, and a cured film which is obtained by curing the photosensitive resin composition. The photosensitive resin composition including a resin and a photopolymerization initiator. The resin is a polyamide resin including a structural unit, which includes a specific saturated alicyclic skeleton, and at least one carboxy group esterified by a unit containing a polymerizable group of a predetermined structure.
一种具有良好粘附性和优异透明度的光敏树脂组合物,用于形成固化膜,其中包括用于光敏树脂组合物的聚酰胺树脂,制备聚酰胺树脂的方法,用作聚酰胺树脂原料的化合物,制备该化合物的方法,使用光敏树脂组合物制备固化膜的方法,以及通过固化光敏树脂组合物获得的固化膜。光敏树脂组合物包括树脂和光聚合引发剂。该树脂是一种聚酰胺树脂,包括结构单元,其中包括特定的饱和脂环骨架,以及至少一个由具有预定结构的可聚合基含有的单元酯化的羧基。