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pyrrolidine-2,3,4,5-tetracarboxylic acid | 180142-01-2

中文名称
——
中文别名
——
英文名称
pyrrolidine-2,3,4,5-tetracarboxylic acid
英文别名
2,3,4,5-Pyrrolidinetetracarboxylic acid
pyrrolidine-2,3,4,5-tetracarboxylic acid化学式
CAS
180142-01-2
化学式
C8H9NO8
mdl
——
分子量
247.161
InChiKey
YKWDNEXDHDSTCU-UHFFFAOYSA-N
BEILSTEIN
——
EINECS
——
  • 物化性质
  • 计算性质
  • ADMET
  • 安全信息
  • SDS
  • 制备方法与用途
  • 上下游信息
  • 反应信息
  • 文献信息
  • 表征谱图
  • 同类化合物
  • 相关功能分类
  • 相关结构分类

计算性质

  • 辛醇/水分配系数(LogP):
    -4.4
  • 重原子数:
    17
  • 可旋转键数:
    4
  • 环数:
    1.0
  • sp3杂化的碳原子比例:
    0.5
  • 拓扑面积:
    161
  • 氢给体数:
    5
  • 氢受体数:
    9

文献信息

  • Aromatic polyamic acid and polyimide
    申请人:Wang Hongyuan
    公开号:US20070149758A1
    公开(公告)日:2007-06-28
    The present invention relates to an aromatic polyimide which has excellent heat resistance and excellent thermal dimensional stability, and which realizes low hygroscopic property, and an aromatic polyamic acid as a precursor for the aromatic polyimide. Provided are an aromatic polyamic acid including a structural unit represented by the following general formula (1), and an aromatic polyimide obtained by imidating the aromatic polyamic acid. The aromatic polyamic acid or the aromatic polyimide can be a copolymerization-type aromatic polyamic acid or aromatic polyimide having another structural unit: where, Ar 1 represents a tetravalent organic group produced from a tetracarboxylic acid having one or more aromatic rings, and R represents a hydrocarbon having 2 to 6 carbon atoms.
    本发明涉及一种具有优异耐热性和优异热尺寸稳定性的芳香族聚酰亚胺,实现低吸湿性能,并提供作为该芳香族聚酰亚胺前体的芳香族聚酰胺。提供了一种包括下述一般式(1)所表示的结构单元的芳香族聚酰胺和通过对芳香族聚酰胺进行酰亚胺化而得到的芳香族聚酰亚胺。芳香族聚酰胺或芳香族聚酰亚胺可以是具有另一种结构单元的共聚型芳香族聚酰胺或芳香族聚酰亚胺:其中,Ar1表示由具有一个或多个芳环的四羧酸产生的四价有机基团,而R表示具有2至6个碳原子的碳氢化合物。
  • FILM-LIKE ADHESIVE, ADHESIVE SHEET, AND SEMICONDUCTOR DEVICE USING SAME
    申请人:Masuko Takashi
    公开号:US20100239858A1
    公开(公告)日:2010-09-23
    An object of the present invention is to provide a film-like adhesive capable of achieving a superior combination of processability and reflow resistance. A film-like adhesive of the present invention is used for bonding a semiconductor element to an adherend, and includes an adhesive layer comprising at least one resin selected from the group consisting of polyurethaneimide resins, polyurethaneamideimide resins and polyurethaneimide-polyurethaneamideimide resins.
    本发明的目的是提供一种类似于薄膜的粘合剂,能够实现优秀的加工性和回流抗性的组合。本发明的类似于薄膜的粘合剂用于将半导体元件粘合到粘合体上,包括一个粘合层,该粘合层包括至少一种树脂,所述树脂从聚氨酯酰亚胺树脂、聚氨酯酰胺酰亚胺树脂和聚氨酯酰亚胺-聚氨酯酰胺酰亚胺树脂组成的群体中选出。
  • CIRCUIT CONNECTING MATERIAL, CONNECTION STRUCTURE OF CIRCUIT MEMBER, AND METHOD FOR MANUFACTURING CONNECTION STRUCTURE OF CIRCUIT MEMBER
    申请人:Arifuku Motohiro
    公开号:US20100243303A1
    公开(公告)日:2010-09-30
    The present invention provides a circuit connecting material for electrically connecting a first circuit member having a first circuit electrode formed on a major surface of a first circuit substrate, and a second circuit member having a second circuit electrode formed on a major surface of a second circuit substrate, with the first and the second circuit electrodes opposed to each other, comprising an adhesive component containing a fluorine-containing organic compound, wherein the adhesive component contains 0.10% or less by mass of a silicon-containing compound, in terms of silicon atoms, based on the total amount of the adhesive component.
    本发明提供了一种电路连接材料,用于电性连接第一电路基板的主表面上形成有第一电路电极的第一电路部件和第二电路基板的主表面上形成有第二电路电极的第二电路部件,其中第一和第二电路电极相对,包括含有含氟有机化合物的粘合剂组分,其中粘合剂组分在总量的基础上,含有的含硅化合物质量分数不超过0.10%。
  • Improvements in or relating to siloxanes
    申请人:M & T CHEMICALS, INC.
    公开号:EP0054426A2
    公开(公告)日:1982-06-23
    The properties of polymeric compositions can be improved by the presence of a polysiloxane unit of formula where Q is a substituted or unsubstituted aromatic group, D is unsubstituted or substituted hydrocarbylene R1, R2, R3, R4, R5 and R6 each, independently, is unsubstituted or substituted hydrocarbyl. x, y and z each independently has a value from 0 to 100. Polyimides containing these units display improved solubility and adhesion; they are useful, among other things, as protective coatings.
    聚合体组合物的性能可以通过存在式中的聚硅氧烷单元得到改善 式中 Q 是取代或未取代的芳香基团、 D为未取代或取代的烃基 R1、R2、R3、R4、R5 和 R6 各自独立地为未取代或取代的烃基。 x、y 和 z 各自独立地具有 0 至 100 之间的数值。 含有这些单元的聚酰亚胺具有更好的溶解性和粘附性,可用作保护涂层等。
  • Improved polyamide acids, polyimides, poly(esterimides)
    申请人:NATIONAL STARCH AND CHEMICAL INVESTMENT HOLDING CORPORATION
    公开号:EP0163518A2
    公开(公告)日:1985-12-04
    Aromatic or aliphatic dianhydrides and/or acid anhydrides are reacted with aromatic diamines of formula (a) alone or in combination with other diamines to produce polyimides, polyamide acids, poly(amide-imides), poly(amide-amide acids), poly(esterimides) or poly)esteramide acids). These polymers are thermoplastic in nature and have improved processing characteristics and thermal stability. The polymers may be prepared by either melt or solution polymerization techniques. wherein R1, R2 and R3 each independently is hydrogen, halogen or unsubstituted or substituted hydrocarbyl, X1 and X2 each independently is substituted or unsubstituted branched, linear or cyclic alkylene or alkenylene of 1 to about 30 carbon atoms, -S-, or -O- with the proviso that X, or X2 and may not both concurrently be -S- or -0-. n, n' and n" each independently is an integer of 1 to 4.
    芳香族或脂肪族二酸酐和/或酸酐单独或与其他二胺一起与式 (a) 的芳香族二胺反应,可生成聚酰亚胺、聚酰胺酸、聚(酰胺酰亚胺)、聚(酰胺酸)、聚(酯酰亚胺)或聚(酯酰胺酸)。这些聚合物具有热塑性,并具有更好的加工特性和热稳定性。这些聚合物可通过熔融聚合或溶液聚合技术制备。 其中 R1、R2 和 R3 各自独立地为氢、卤素或未取代或取代的烃基、 X1 和 X2 各自独立地为取代或未取代的 1 至约 30 个碳原子的支链、线性或环状亚烷基或烯基、-S- 或 -O-,但 X 或 X2 不能同时为 -S- 或 -0-。 n、n'和 n "各自独立地为 1 至 4 的整数。
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