Silicon-containing resists underlayer film-forming composition having phenyl group-containing chromophore
申请人:NISSAN CHEMICAL INDUSTRIES, LTD.
公开号:US10197917B2
公开(公告)日:2019-02-05
The present invention provides a resist underlayer film-forming composition for lithography for forming a resist underlayer film that can be used as a hard mask with use of hydrolysis-condensation product of a hydrolyzable silane which also absorbs KrF laser. A resist underlayer film-forming composition for lithography comprising, as a silane, a hydrolyzable silane, a hydrolysis product thereof, or a hydrolysis-condensation product thereof, wherein the hydrolyzable silane includes a hydrolyzable silane of Formula (1):
R1aR2bSi(R3)4−(a+b) Formula (1)
[where R1 is an organic group of Formula (2):
and is bonded to a silicon atom through a Si−C bond; R3 is an alkoxy group, an acyloxy group, or a halogen group; a is an integer of 1; b is an integer of 0 to 2; and a+b is an integer of 1 to 3], and a ratio of sulfur atoms to silicon atoms is 7% by mole or more in the whole of the silane. A resist underlayer film obtained by applying the resist underlayer film-forming composition onto a semiconductor substrate and baking it.
本发明提供了一种用于光刻的抗蚀剂底层成膜组合物,利用可水解硅烷的水解缩合产物形成可用作硬掩膜的抗蚀剂底层膜,该抗蚀剂底层膜还可吸收 KrF 激光。一种用于光刻的抗蚀剂底层成膜组合物,其硅烷成分包括可水解硅烷、其水解产物或其水解缩合产物,其中可水解硅烷包括式(1)的可水解硅烷:
R1aR2bSi(R3)4-(a+b) 式(1)
[其中 R1 是式 (2) 的有机基团:
R3 是烷氧基、酰氧基或卤素基团;a 是 1 的整数;b 是 0 至 2 的整数;a+b 是 1 至 3 的整数],且整个硅烷中硫原子与硅原子的摩尔比为 7% 或以上。将抗蚀剂底层成膜组合物涂在半导体衬底上并烘烤而得到的抗蚀剂底层薄膜。