Einecs 282-802-2 | 84434-04-8

• 分子结构分类: 有机化合物 - 有机杂环化合物 - 苯并三唑类
• 英文名称: Einecs 282-802-2
• 英文别名: 2-aminoethanol;2H-benzotriazole
• CAS: 84434-04-8
• 化学式: C₂H₇NO*2C₆H₅N₃
• 分子量: 299.335
• InChiKey: HZLYYYOXWTVWFA-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  -0.1
• 重原子数：
  13
• 可旋转键数：
  1
• 环数：
  2.0
• sp3杂化的碳原子比例：
  0.25
• 拓扑面积：
  87.8
• 氢给体数：
  3
• 氢受体数：
  4

反应信息

• 作为产物：
  描述：

  T406石油添加剂 、 C.I.酸性橙108 以 醋酸异丙酯 为溶剂， 以4.3 g的产率得到Einecs 282-802-2
  参考文献：
  名称：

  苯并三唑-胺配合物的协同性：分子识别界面的变构调节

  摘要：

  苯并三唑与胺形成稳定的络合物，在某些情况下会从极性有机溶剂的溶液中以晶体形式自发分离。这些配合物的化学计量和结合常数已通过在氘代氯仿中的1 H NMR分析确定。络合过程中涉及的平衡的定量分析揭示了溶液中苯并三唑的行为，并给出了当存在多种相互作用时变构效应的影响的估计值。版权所有©2010 John Wiley＆Sons，Ltd.

  DOI：

  10.1002/poc.1715

文献信息

• CLEANING AGENT FOR SUBSTRATE AND CLEANING METHOD
  申请人：Wako Pure Chemical Industries, Ltd.

  公开号：EP1679361A1

  公开（公告）日：2006-07-12

  The present invention provides a cleaning agent for a substrate and a cleaning method thereof, which can effectively remove fine particles (particles) present on a surface of substrate or impurities derived from various kinds of metals (metallic impurities), without causing roughness surface of a substrate, in particular, a semiconductor substrate, and without causing corrosion or oxidation of metal wirings, in particular, copper wirings, provided on a surface of substrate, and can further remove at the same time a carbon defect present on a surface of substrate, without removing a metal corrosion inhibitor - Cu film, in particular, a Cu-BTA film. The present invention provides a cleaning agent for a substrate comprising [I] an organic acid having at least one carboxyl group and/or [II] a complexing agent, and [III] an organic solvent selected from the group consisting of (1) monohydric alcohols, (2) alkoxyalcohols, (3) glycols, (4) glycol ethers, (5) ketones and (6) nitriles, and a cleaning method for a surface of substrate, which comprises the surface of substrate is treated with said cleaning agent.

  本发明提供了一种用于基板的清洗剂及其清洗方法，该清洗剂可有效去除存在于基板表面的细小颗粒（微粒）或来自各种金属的杂质（金属杂质），而不会导致基板（尤其是半导体基板）表面粗糙，也不会导致设置在基板表面的金属线（尤其是铜线）腐蚀或氧化，并可进一步同时去除存在于基板表面的碳缺陷，而不会去除金属缓蚀剂-Cu膜（尤其是Cu-BTA膜）。 本发明提供了一种用于基材的清洗剂，包括[I]具有至少一个羧基的有机酸和/或[II]络合剂，以及[III]选自以下组别的有机溶剂：(1)一元醇、(2)烷氧基乙醇、(3)乙二醇、(4)乙二醇醚、(5)酮和(6)腈。
• ADHESIVE COMPOSITION FOR ELECTRONIC COMPONENTS AND ADHESIVE SHEET FOR ELECTRONIC COMPONENTS USING THE SAME
  申请人：Toray Industries, Inc.

  公开号：EP2192167A1

  公开（公告）日：2010-06-02

  In order to provide an adhesive composition for electronic components that is excellent in adhesion durability under long-term high temperature conditions, thermal cyclability, and insulation reliability, designed is an adhesive composition for electronic components containing a thermoplastic resin (a), an epoxy resin (b), a hardener (c), and an organopolysiloxane (d), wherein the glass transition temperature (Tg) after curing is -10°C to 50°C and the rate of change of Tg after heat-treating the composition at 175°C for 1000 hours is 15% or less.

  为了提供一种电子元件用粘合剂组合物，该组合物在长期高温条件下具有优异的粘合耐久性、热循环性和绝缘可靠性，设计了一种电子元件用粘合剂组合物，该组合物含有热塑性树脂（a）、环氧树脂（b）、固化剂（c）和有机聚硅氧烷（d），其中固化后的玻璃化转变温度（Tg）为-10°C 至 50°C，在 175°C 下热处理 1000 小时后的 Tg 变化率为 15%或以下。
• JPS56122884A
  申请人：——

  公开号：JPS56122884A

  公开（公告）日：1981-09-26
• JPS63234013A
  申请人：——

  公开号：JPS63234013A

  公开（公告）日：1988-09-29
• Cleaning Agent for Substrate and Cleaning Method
  申请人：Mizuta Hironori

  公开号：US20070235061A1

  公开（公告）日：2007-10-11

  The present invention provides a cleaning agent for a substrate and a cleaning method thereof, which can effectively remove fine particles (particles) present on a surface of substrate or impurities derived from various kinds of metals (metallic impurities), without causing roughness surface of a substrate, in particular, a semiconductor substrate, and without causing corrosion or oxidation of metal wirings, in particular, copper wirings, provided on a surface of substrate, and can further remove at the same time a carbon defect present on a surface of substrate, without removing a metal corrosion inhibitor—Cu film, in particular, a Cu-BTA film. The present invention provides a cleaning agent for a substrate comprising [I] an organic acid having at least one carboxyl group and/or [II] a complexing agent, and [III] an organic solvent selected from the group consisting of (1) monohydric alcohols, (2) alkoxyalcohols, (3) glycols, (4) glycol ethers, (5) ketones and (6) nitriles, and a cleaning method for a surface of substrate, which comprises the surface of substrate is treated with said cleaning agent.