1-Isocyanooxy-4-methylbenzene | 90368-35-7

• 分子结构分类: 有机化合物 - 苯类化合物 - 苯和取代衍生物
• 英文名称: 1-Isocyanooxy-4-methylbenzene
• CAS: 90368-35-7
• 化学式: C₈H₇NO
• 分子量: 133.15
• InChiKey: FYIZSPXHGGOWET-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  2.7
• 重原子数：
  10
• 可旋转键数：
  1
• 环数：
  1.0
• sp3杂化的碳原子比例：
  0.12
• 拓扑面积：
  13.6
• 氢给体数：
  0
• 氢受体数：
  2

反应信息

• 作为产物：
  描述：

  4,4'-二甲基二苯基碘鎓 以 丙酮 为溶剂， 生成 1-Isocyanooxy-4-methylbenzene
  参考文献：
  名称：

  Reactive nitrogenous molecules from Meldrum's acid derivatives, pyrrole-2,3-diones, and isoxazolones

  摘要：

  DOI：

  10.1021/jo00189a025

文献信息

• IMIDE-LINKED MALEIMIDE AND POLYMALEIMIDE COMPOUNDS
  申请人：Mizori Farhad G.

  公开号：US20110130485A1

  公开（公告）日：2011-06-02

  The invention is directed to maleimide thermosets incorporating imide-extended mono-, bis-, or polymaleimide compounds. These imide-extended maleimide compounds are prepared by the condensation of appropriate anhydrides with appropriate diamines to give amine terminated compounds. These compounds are then condensed with excess maleic anhydride to yield imide-extended maleimide compounds.

  这项发明涉及将咪唑烯烃热固性树脂与亚酰亚胺扩展的单、双或多咪唑烯烃化合物结合。这些亚酰亚胺扩展的咪唑烯烃化合物是通过适当的酐与适当的二胺进行缩合反应制备的，以得到末端带有胺基的化合物。然后，这些化合物与过量的马来酸酐缩合，得到亚酰亚胺扩展的咪唑烯烃化合物。
• Imide-linked maleimide and polymaleimide compounds
  申请人：Mizori G. Farhad

  公开号：US20080075961A1

  公开（公告）日：2008-03-27

  The invention is based on the discovery that a remarkable improvement in the performance of maleimide thermosets can be achieved through the incorporation of imide-extended mono-, bis-, or polymaleimide compounds. These imide-extended maleimide compounds are readily prepared by the condensation of appropriate anhydrides with appropriate diamines to give amine terminated compounds. These compounds are then condensed with excess maleic anhydride to yield imide-extended maleimide compounds.
• MATERIALS AND METHODS FOR STRESS REDUCTION IN SEMICONDUCTOR WAFER PASSIVATION LAYERS
  申请人：DESIGNER MOLECULES, INC.

  公开号：US20130228901A1

  公开（公告）日：2013-09-05

  The present invention provides polyimide polymer materials for passivating semiconductor wafers and methods for fabricating thereof. The present invention further provides a device that includes a semiconductor wafer and a passivating layer disposed on the surface of the wafer, wherein the passivating layer comprises such polyimide polymers.
• US7884174B2
  申请人：——

  公开号：US7884174B2

  公开（公告）日：2011-02-08
• US8513375B2
  申请人：——

  公开号：US8513375B2

  公开（公告）日：2013-08-20