1H-Benzotriazol Morpholin salt | 84604-74-0

• 分子结构分类: 有机化合物 - 有机杂环化合物 - 苯并三唑类
• 英文名称: 1H-Benzotriazol Morpholin salt
• 英文别名: Einecs 283-357-7；2H-benzotriazole;morpholine
• CAS: 84604-74-0
• 化学式: C₄H₉NO*C₆H₅N₃
• 分子量: 206.247
• InChiKey: OZIKLUQNNGASRY-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  0.56
• 重原子数：
  15
• 可旋转键数：
  0
• 环数：
  3.0
• sp3杂化的碳原子比例：
  0.4
• 拓扑面积：
  62.8
• 氢给体数：
  2
• 氢受体数：
  4

反应信息

• 作为产物：
  描述：

  吗啉 、 T406石油添加剂 以 醋酸异丙酯 为溶剂， 以6.4 g的产率得到1H-Benzotriazol Morpholin salt
  参考文献：
  名称：

  苯并三唑-胺配合物的协同性：分子识别界面的变构调节

  摘要：

  苯并三唑与胺形成稳定的络合物，在某些情况下会从极性有机溶剂的溶液中以晶体形式自发分离。这些配合物的化学计量和结合常数已通过在氘代氯仿中的1 H NMR分析确定。络合过程中涉及的平衡的定量分析揭示了溶液中苯并三唑的行为，并给出了当存在多种相互作用时变构效应的影响的估计值。版权所有©2010 John Wiley＆Sons，Ltd.

  DOI：

  10.1002/poc.1715

文献信息

• CLEANING AGENT FOR SUBSTRATE AND CLEANING METHOD
  申请人：Wako Pure Chemical Industries, Ltd.

  公开号：EP1679361A1

  公开（公告）日：2006-07-12

  The present invention provides a cleaning agent for a substrate and a cleaning method thereof, which can effectively remove fine particles (particles) present on a surface of substrate or impurities derived from various kinds of metals (metallic impurities), without causing roughness surface of a substrate, in particular, a semiconductor substrate, and without causing corrosion or oxidation of metal wirings, in particular, copper wirings, provided on a surface of substrate, and can further remove at the same time a carbon defect present on a surface of substrate, without removing a metal corrosion inhibitor - Cu film, in particular, a Cu-BTA film. The present invention provides a cleaning agent for a substrate comprising [I] an organic acid having at least one carboxyl group and/or [II] a complexing agent, and [III] an organic solvent selected from the group consisting of (1) monohydric alcohols, (2) alkoxyalcohols, (3) glycols, (4) glycol ethers, (5) ketones and (6) nitriles, and a cleaning method for a surface of substrate, which comprises the surface of substrate is treated with said cleaning agent.

  本发明提供了一种用于基板的清洗剂及其清洗方法，该清洗剂可有效去除存在于基板表面的细小颗粒（微粒）或来自各种金属的杂质（金属杂质），而不会导致基板（尤其是半导体基板）表面粗糙，也不会导致设置在基板表面的金属线（尤其是铜线）腐蚀或氧化，并可进一步同时去除存在于基板表面的碳缺陷，而不会去除金属缓蚀剂-Cu膜（尤其是Cu-BTA膜）。 本发明提供了一种用于基材的清洗剂，包括[I]具有至少一个羧基的有机酸和/或[II]络合剂，以及[III]选自以下组别的有机溶剂：(1)一元醇、(2)烷氧基乙醇、(3)乙二醇、(4)乙二醇醚、(5)酮和(6)腈。
• Cleaning Agent for Substrate and Cleaning Method
  申请人：Mizuta Hironori

  公开号：US20070235061A1

  公开（公告）日：2007-10-11

  The present invention provides a cleaning agent for a substrate and a cleaning method thereof, which can effectively remove fine particles (particles) present on a surface of substrate or impurities derived from various kinds of metals (metallic impurities), without causing roughness surface of a substrate, in particular, a semiconductor substrate, and without causing corrosion or oxidation of metal wirings, in particular, copper wirings, provided on a surface of substrate, and can further remove at the same time a carbon defect present on a surface of substrate, without removing a metal corrosion inhibitor—Cu film, in particular, a Cu-BTA film. The present invention provides a cleaning agent for a substrate comprising [I] an organic acid having at least one carboxyl group and/or [II] a complexing agent, and [III] an organic solvent selected from the group consisting of (1) monohydric alcohols, (2) alkoxyalcohols, (3) glycols, (4) glycol ethers, (5) ketones and (6) nitriles, and a cleaning method for a surface of substrate, which comprises the surface of substrate is treated with said cleaning agent.
• US8900371B2
  申请人：——

  公开号：US8900371B2

  公开（公告）日：2014-12-02