The invention is based on the discovery that adhesive compositions containing certain low-viscosity, mono-ethylenically unsaturated monomers have surprisingly good cure parameters, resulting in very little weight loss upon cure. Many of these monofunctional monomers used alone or in combination with other monofunctional monomers described herein have high glass transition temperatures when cured. Moreover, since these monomers are monofunctional the crosslink density of the adhesive composition does not increase (relative to multi-functional monomers), which in turns results in lower stress, lower modulus adhesive compositions. As such, these monomers are useful in a variety of thermoset adhesive compositions, such as for example, die attach adhesive compositions.
该发明是基于发现,含有某些低黏度、单
乙烯不饱和单体的粘合剂组合物具有惊人的固化参数,固化后重量损失非常小。其中许多单官能单体单独使用或与本文所述其他单官能单体组合使用时,在固化后具有较高的
玻璃转移温度。此外,由于这些单体是单官能的,粘合剂组合物的交联密度不会增加(相对于多官能单体),这反过来将导致较低的应力、较低的模量粘合剂组合物。因此,这些单体在各种热固性粘合剂组合物中非常有用,例如,封装粘合剂组合物。