申请人:KABUSHIKI KAISHA TOSHIBA
公开号:EP0114258A1
公开(公告)日:1984-08-01
Disclosed is a resin encapsulation type photo-semiconductor device, which comprises a photo-semiconductor element encapsulated with a photopolymerizable composition comprising an epoxy resin, an aluminum compound and a silicon compound capable of forming a silanol group by irradiation with light.
本发明公开了一种树脂封装型光电半导体器件,该器件包括一个光电半导体元件,封装在由环氧树脂、铝化合物和硅化合物组成的可光聚合组合物中,通过光照射可形成硅醇基。