Thermoplastic molding compositions with improved adhesion of electroplated metal layer
申请人:BASF Aktiengesellschaft
公开号:EP1764392A1
公开(公告)日:2007-03-21
Summary
A thermoplastic molding composition with improved metal plating properties is provided. This thermoplastic molding composition is produced from a graft copolymer (A) a thermoplastic polymer (B) and a thermoplastic polymer (C) that is not, or only to a limited amount miscible with the thermoplastic polymer (B). The thermoplastic polymer (C) contains from 1 to 10 % by weight of at least one monoethylenically unsaturated monomer, like acrylic acid, methacrylic acid, or dicarboxylic acids, such as maleic acid and fumaric acid and their anhydrides, such as maleic anhydride. The vinyl aromatic content of component (C) is at least 5 units lower compared to that of component (B).
The graft copolymer is produced from a soft elastomeric particulate graft base with a glass transition temperature below 0°C obtained by emulsion polymerization of a conjugated diene alone or with a small amount of a monoethylenically unsaturated monomer or of at least one C1-8-alkyl acrylate, or of mixtures of these, upon which is grafted a vinyl aromatic monomer and acrylonitrile and optionally another monoethylenically unsaturated monomer.
摘要
提供了一种具有改进的金属电镀性能的热塑性模塑组合物。这种热塑性模塑组合物由接枝共聚物(A)、热塑性聚合物(B)和与热塑性聚合物(B)不混溶或仅有少量混溶的热塑性聚合物(C)制成。热塑性聚合物(C)含有至少一种单乙烯不饱和单体,如丙烯酸、甲基丙烯酸或二羧酸,如马来酸和富马酸及其酸酐,如马来酸酐,按重量计,含量为 1%至 10%。与组分(B)相比,组分(C)的乙烯基芳烃含量至少低 5 个单位。
接枝共聚物是由软弹性颗粒接枝基制成的,该接枝基的玻璃化温度低于 0°C,它是由共轭二烯单独或与少量单乙烯基不饱和单体或至少一种 C1-8 烷基丙烯酸酯或它们的混合物进行乳液聚合而得到的,在该接枝基上接枝了乙烯基芳香族单体和丙烯腈以及另一种单乙烯基不饱和单体。