The present invention provides a photosensitive resin which is rich in heat resistance and flexibility. The present invention relates to the unsaturated group-containing polyimide resin obtained through a reaction between a polyimide resin, which is obtained by polyimidization of a polyamide acid obtained through a reaction between a diamino-6-hydroxypyrimidine (diamine component (A)) and an aromatic tetrabasic acid dianhydride (C), and an unsaturated group-containing compound, preferably a compound having a reactive group such as an acid anhydride group or isocyanate group and an unsaturated group; relates to a photosensitive resin composition containing such resin, a crosslinking agent and photopolymerization initiator; and relates to a cured product of such a resin composition. The photosensitive resin composition containing such an unsaturated group-containing polyimide resin has good development characteristic and photosensitivity, and enables to form the polyimide resin cured film without requiring a heat treatment step. The cured film has flexibility and is excellent in solvent resistance as well.
本发明提供了一种富于耐热性和柔韧性的光敏
树脂。本发明涉及一种含不饱和基团的聚
酰亚胺树脂,这种聚
酰亚胺树脂是通过二
氨基-6-
羟基嘧啶(二胺组分(A))和芳香族四
溴二酸酐(C)反应得到的聚酰胺酸的聚
酰亚胺化而得到的;本发明还涉及一种含不饱和基团的化合物,这种化合物最好是具有酸酐基团或
异氰酸酯基团等活性基团和不饱和基团的化合物;涉及一种含有这种
树脂、
交联剂和光聚合
引发剂的光敏
树脂组合物;以及涉及这种
树脂组合物的固化产品。含有这种含不饱和基团的聚
酰亚胺树脂的光敏
树脂组合物具有良好的显影特性和光敏性,无需热处理步骤即可形成聚
酰亚胺树脂固化膜。固化膜具有柔韧性和优异的耐溶剂性。