1,3-bis(4-formyl-2-methoxyphenoxy)-2-hydroxypropane

• 分子结构分类: 有机化合物 - 苯类化合物 - 苯和取代衍生物
• 英文名称: 1,3-bis(4-formyl-2-methoxyphenoxy)-2-hydroxypropane
• 英文别名: 4,4'-[(2-Hydroxy-1,3-propanediyl)bis(oxy)]bis[3-methoxybenzaldehyde]；4-[3-(4-formyl-2-methoxyphenoxy)-2-hydroxypropoxy]-3-methoxybenzaldehyde
• 化学式: C₁₉H₂₀O₇
• 分子量: 360.364
• InChiKey: ZHEJIOUQESBHDG-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  1.8
• 重原子数：
  26
• 可旋转键数：
  10
• 环数：
  2.0
• sp3杂化的碳原子比例：
  0.26
• 拓扑面积：
  91.3
• 氢给体数：
  1
• 氢受体数：
  7

反应信息

• 作为产物：
  描述：

  香草醛 、 环氧氯丙烷 在 四甲基氢氧化铵 作用下， 以 乙醇 、 水 为溶剂， 反应 20.0h， 以94%的产率得到1,3-bis(4-formyl-2-methoxyphenoxy)-2-hydroxypropane
  参考文献：
  名称：

  LASER ABLATIVE DIELECTRIC MATERIAL

  摘要：

  提出了具有最佳机械性能的介电材料，用于激光消融图案化。这些材料包括从聚脲、聚氨酯和聚酰肼酮组成的聚合物。还提供了制备适当聚酰肼酮的新方法。这些方法使用温和条件，产生在室温下稳定的可溶聚合物，可被包含在可涂覆到微电子基板上的配方中。介电材料表现出高延展性、低CTE、低固化温度，并在消融后几乎不留碎屑。

  公开号：

  US20180019156A1

文献信息

• Condensation polymer containing the residue of a poly-methine compound
  申请人：Eastman Kodak Company

  公开号：US04749774A1

  公开（公告）日：1988-06-07

  Composition useful for molding into articles which as food containers, beverage bottles, cured structural plastics and the like comprising molding grade linear or unsaturated polyester or polycarbonate having reacted therewith or copolymerized therein the residue of one or more poly-methine compounds having the formula: ##STR1## wherein each R.sup.1 is independently selected from cyano, carboxy, alkenyloxycarbonyl, or a substituted or unsubstituted alkoxycarbonyl, cycloalkoxoycarbonyl or aryloxycarbonyl radical; each R.sup.2 is independently selected from one of the groups specified for R.sup.1 or an unsubstituted or substituted aryl, carbamoyl, alkanoyl, cycloalkanoyl, aroyl, alkylsulfonyl, cycloalkylsulfonyl, arylsulfonyl or aromatic, heterocyclic radical; each R.sup.3 is independently selected from hydrogen or an unsubstituted or substituted alkyl, cycloalkyl or aryl radical; A.sup.1 and A.sup.2 are independently selected from 1,4-phenylene radicals; and L is an organic linking group bonded by non-oxo carbon atoms to the oxygen atoms adjacent to L; provided the poly-methine compound bears at least one substituent that is reactive with one of the monomers from which the condensation polymer is derived. The polymethine residues are present in the polymer as an integral part of the polymer chain and absorb ultraviolet radiation in the range of about 250 to about 390 nm. The residues are non-extractable from the polymer and stable at the conditions at which the polymers are manufactured and processed.

  本发明涉及一种用于成型成食品容器、饮料瓶、固化结构塑料等物品的组合物，包括成型级别的线性或不饱和聚酯或聚碳酸酯，其中反应或共聚其中的是一种或多种聚甲烯化合物的残留物，其公式为：##STR1## 其中每个R.sup.1独立地选自氰基、羧基、烯丙氧羰基或取代或未取代的烷氧羰基、环烷氧基羰基或芳香氧基羰基基团；每个R.sup.2独立地选自R.sup.1指定的一组或未取代或取代的芳香族、氨基甲酰、脂肪酰、环烷酰、芳香酰、烷基磺酰、环烷基磺酰、芳香基磺酰或芳香族、杂环基基团；每个R.sup.3独立地选自氢或未取代或取代的烷基、环烷基或芳香基基团；A.sup.1和A.sup.2独立地选自1,4-苯基基团；L是有机连接基团，通过非氧化碳原子与L相邻的氧原子相连；提供聚甲烯化合物至少带有一个与缩聚聚合物来源单体之一反应的取代基。聚甲烯残留物以聚合物链的一部分的形式存在于聚合物中，并在约250至约390纳米的紫外线范围内吸收紫外线辐射。残留物从聚合物中不可提取，在制造和加工聚合物的条件下稳定。
• Laser ablative dielectric material
  申请人：Brewer Science Inc.

  公开号：US10304720B2

  公开（公告）日：2019-05-28

  Dielectric materials with optimal mechanical properties for use in laser ablation patterning are proposed. These materials include a polymer selected from the group consisting of polyureas, polyurethane, and polyacylhydrazones. New methods to prepare suitable polyacylhydrazones are also provided. Those methods involve mild conditions and result in a soluble polymer that is stable at room temperature and can be incorporated into formulations that can be coated onto microelectronic substrates. The dielectric materials exhibit high elongation, low CTE, low cure temperature, and leave little to no debris post-ablation.

  本文提出了具有最佳机械性能的介电材料，可用于激光烧蚀制图。这些材料包括选自聚脲、聚氨酯和聚酰肼的聚合物。还提供了制备合适的聚酰肼的新方法。这些方法的条件温和，制备出的可溶性聚合物在室温下稳定，可与可涂覆到微电子基板上的配方结合。这种介电材料具有高伸长率、低 CTE、低固化温度，并且在烧蚀后几乎不会留下任何碎屑。
• AVETISYAN, A. S.;MINASYAN, S. A.;MARKARYAN, EH. A., ARM. XIM. ZH., 42,(1989) N, S. 514-518
  作者：AVETISYAN, A. S.、MINASYAN, S. A.、MARKARYAN, EH. A.

  DOI：——

  日期：——
• US4749774A
  申请人：——

  公开号：US4749774A

  公开（公告）日：1988-06-07
• LASER ABLATIVE DIELECTRIC MATERIAL
  申请人：Brewer Science Inc.

  公开号：US20180019156A1

  公开（公告）日：2018-01-18

  Dielectric materials with optimal mechanical properties for use in laser ablation patterning are proposed. These materials include a polymer selected from the group consisting of polyureas, polyurethane, and polyacylhydrazones. New methods to prepare suitable polyacylhydrazones are also provided. Those methods involve mild conditions and result in a soluble polymer that is stable at room temperature and can be incorporated into formulations that can be coated onto microelectronic substrates. The dielectric materials exhibit high elongation, low CTE, low cure temperature, and leave little to no debris post-ablation.

  提出了具有最佳机械性能的介电材料，用于激光消融图案化。这些材料包括从聚脲、聚氨酯和聚酰肼酮组成的聚合物。还提供了制备适当聚酰肼酮的新方法。这些方法使用温和条件，产生在室温下稳定的可溶聚合物，可被包含在可涂覆到微电子基板上的配方中。介电材料表现出高延展性、低CTE、低固化温度，并在消融后几乎不留碎屑。