BIS(AMINOPHENOL) DERIVATIVE, PROCESS FOR PRODUCING SAME, POLYAMIDE RESIN, POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, PROTECTIVE FILM, INTERLAYER DIELECTRIC FILM, SEMICONDUCTOR DEVICE, AND DISPLAY ELEMENT
申请人:Terakawa Koji
公开号:US20100044888A1
公开(公告)日:2010-02-25
A bis(aminophenol) derivative having substituents at positions adjacent to two amino groups is provided. The bis(aminophenol) derivative is used as a raw material of a polyamide resin for a positive-tone photosensitive resin composition. A polyamide resin comprising bis(aminophenol) and a structure derived from a carboxylic acid is also provided, the bis(aminophenol) having substituents at positions adjacent to the two amino groups. A positive-tone photosensitive resin composition comprising a polybenzooxazole precursor resin, exhibiting high sensitivity and a high cyclization rate even when cured at a low temperature is provided. Also provided is a positive-tone photosensitive resin composition comprising a polyamide resin having an imide structure, an imide precursor structure, or an amide acid ester structure. The composition exhibits high sensitivity and produces a cured product having low water absorption even when cured at a low temperature.
A multi-enzymatic cascade reaction for the synthesis of bioactive C-oligosaccharides
作者:Kebo Xie、Qian Zhang、Fei Ye、Jungui Dai
DOI:10.1016/j.cclet.2023.109028
日期:2024.6
successfully achieved by multi-enzymatic cascade reactions. A glycosyltransferase from was employed to introduce the first linked glucose and then a cyclomaltodextrin glucanotransferase from was used to extend the sugar chain. A total of twenty oligosaccharides with 2–6 sugars were synthesized from scale-up reactions and exhibited good water solubility and sodium-dependent glucose transporter 2 (SGLT2) inhibitory
POLYBENZOXAZOLE PRECURSOR, PHOTOSENSITIVE RESIN COMPOSITION USING THE SAME, AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
申请人:SATO Kenichiro
公开号:US20080076849A1
公开(公告)日:2008-03-27
A polybenzoxazole precursor is represented by the following formula (1):
wherein R
1
a to R
4
a, R
1
b to R
4
b, X
1
, Y
1
and m are defined in the specification.
PHOTOSENSITIVE RESIN COMPOSITION, INSULATING FILM, PROTECTIVE FILM, AND ELECTRONIC EQUIPMENT
申请人:Toyoda Hideyuki
公开号:US20100076156A1
公开(公告)日:2010-03-25
The photosensitive resin composition of the present invention includes an alkali solubility resin including molecules each composed of a main chain having one end and the other end opposite to the one end, an organic group bonded to the one end thereof, the organic group having at least one unsaturated group, and a substituent group bonded to at least one of the other end of the main chain and a branch thereof, the substituent group having a cyclic chemical structure containing nitrogen atoms, and a photosensitive agent. Further, the insulating film of the present invention is composed of a cured product of the above photosensitive resin composition. Furthermore, the protective film of the present invention is composed of a cured product of the above photosensitive resin composition. Moreover, the Electronic equipment of the present invention is provided with the above protective film and insulating film.
PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE
申请人:Banba Toshio
公开号:US20100183985A1
公开(公告)日:2010-07-22
A process for producing a semiconductor device includes a circuit formation step of forming circuit wiring on a semiconductor wafer using a chemically-amplified resist, and a cured film formation step of forming a cured film that protects the circuit wiring after forming the circuit wiring, the cured film being formed of a cured material of a photosensitive resin composition that comprises an alkali-soluble resin having a polybenzoxazole structure or a polybenzoxazole precursor structure, a compound that generates an acid upon exposure to light, and a solvent. The photosensitive resin composition substantially does not contain N-methyl-2-pyrrolidone. The process can suppress a T-top phenomenon or the like that may occur when forming a circuit on a semiconductor wafer using a chemically-amplified resist in the production of semiconductor devices.