MULTIDENTATE LIGAND, MULTI-NUCLEUS METAL COMPLEX, METAL COMPLEX CHAIN, METAL COMPLEX INTEGRATED STRUCTURE, AND PREPARATION METHOD THEREOF
申请人:FUJITSU LIMITED
公开号:EP1489068A1
公开(公告)日:2004-12-22
An object of the present invention is typically to provide a metal complex assembly that is applicable to the miniaturization and elaboration of devices and apparatus in information and communication fields, such as arithmetic and logic units, displays and memories, and to provide a novel multidentate ligand which can be used as a suitable raw material for the metal complex assembly.
The present invention is as follows. A multidentate ligand includes at least two planar tetradentate coordination sites in one plane, each of the planar tetradentate coordination sites containing four nitrogen-containing groups of at least one of imino, amido and amino groups, and has the nitrogen atoms of the four nitrogen-containing groups as coordinating atoms in one plane. A metal complex assembly has one of two-dimensional and three-dimensional structures and contains metal complex chains and electroconductive wires, the metal complex chains each contain assembled metal complexes, the electroconductive wires each contain molecules serving as at least one of an acceptor and a donor, and the metal complex chains intersect with the electroconductive wires at such positions that the metal complexes and the molecules serving as at least one of an acceptor and a donor are capable of interacting with each other.
本发明的目的通常是提供一种适用于信息和通信领域的装置和设备(如算术和逻辑单元、显示器和存储器)的小型化和精细化的金属络合物组件,并提供一种可用作金属络合物组件的合适原材料的新型多叉配体。
本发明的内容如下。一种多齿配体在一个平面上包括至少两个平面四齿配位位点,每个平面四齿配位位点含有四个含氮基团,至少是亚氨基、氨基和氨基中的一种,并在一个平面上以四个含氮基团的氮原子作为配位原子。金属络合物组件具有二维和三维结构中的一种结构,包含金属络合物链和导电线,金属络合物链各自包含组装好的金属络合物,导电线各自包含作为受体和供体中至少一种的分子,金属络合物链与导电线相交的位置使金属络合物和作为受体和供体中至少一种的分子能够相互作用。