5-(4-(2-phenylethynyl)phenoxy) isophthalic acid

• 分子结构分类: 有机化合物 - 苯类化合物 - 苯和取代衍生物
• 英文名称: 5-(4-(2-phenylethynyl)phenoxy) isophthalic acid
• 英文别名: 5-(4-(2-phenylethynyl)phenoxy)isophthalic acid；5-[4-(2-Phenylethynyl)phenoxy]benzene-1,3-dicarboxylic acid
• 化学式: C₂₂H₁₄O₅
• 分子量: 358.35
• InChiKey: KYFYTNUSAGKBRW-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  4.5
• 重原子数：
  27
• 可旋转键数：
  6
• 环数：
  3.0
• sp3杂化的碳原子比例：
  0.0
• 拓扑面积：
  83.8
• 氢给体数：
  2
• 氢受体数：
  5

反应信息

• 作为反应物：
  描述：

  5-(4-(2-phenylethynyl)phenoxy) isophthalic acid 、 1,2-二氯乙烷 在 氯化亚砜 、 苄基三乙基氯化铵 作用下， 以 正己烷 为溶剂， 以46%的产率得到5-(4-(2-phenylethynyl)phenoxy)isophthalic acid dichloride
  参考文献：
  名称：

  EP1346975

  摘要：

  公开号：

文献信息

• Aromatic carboxylic acids, acid halides thereof and processes for preparing both
  申请人：——

  公开号：US20040068139A1

  公开（公告）日：2004-04-08

  A novel aromatic carboxylic acid useful as a material for macromolecular compounds and, in particular, for polycondensed macromolecular compounds exhibiting excellent heat resistance, an acid halide derivative thereof and a process for producing these compounds are disclosed. The aromatic carboxylic acid and the acid halide derivative thereof have structures represented general formulae (1) and (2), respectively, and can be efficiently produced from a dialkyl ester derivative of isophthalic acid and an acetylene derivative in accordance with the disclosed process comprising specific steps. 1 In the above formulae, A represents: —C≡C—R 1 ( a ) or 2 (R 1 represents hydrogen atom, an alkyl group or an aromatic group, R 2 represents an alkyl group or an aromatic group) and X represents a halogen atom.

  本发明揭示了一种新的芳香族羧酸，可用作大分子化合物的材料，特别是用于表现出优异耐热性的聚缩酸大分子化合物，以及其酸卤化衍生物和生产这些化合物的方法。所述芳香族羧酸和其酸卤化衍生物的结构分别表示为通式（1）和（2），可以通过本发明揭示的特定步骤的方法从异苯二甲酸的二烷基酯衍生物和乙炔衍生物高效地生产。在上述公式中，A表示：-C≡C-R1（a）或2（R1表示氢原子，烷基或芳香基，R2表示烷基或芳香基），X表示卤素原子。
• RESIN COMPOSITION, VARNISH, RESIN FILM AND SEMICONDUCTOR DEVICE USING THE SAME
  申请人：Fujita Kazuyoshi

  公开号：US20090118431A1

  公开（公告）日：2009-05-07

  A main object of the present invention is to provide a resin composition having high heat resistance and a low dielectric constant, a varnish thereof, a resin film thereof and a semiconductor device using the same. In the present invention, the object is achieved by a resin composition comprising a compound having a structure represented by formula (1) and a crosslinking agent: wherein in formula (1), R 0 is a single bond or has a structure represented by formula (2); R 1 to R 8 are respectively any of hydrogen, a group having an alicyclic structure, an organic group having 1 to 10 carbon atoms other than the group having an alicyclic structure, a hydroxyl group and a carboxyl group; and “X” is any of —O—, —NHCO—, —CONH—, —COO— and —OCO—; further, wherein in formula (2), “Ar” is an aromatic group; “Y” is any of a single bond —O—, —S—, —OCO— and —COO—; “q” is an integer of 1 or more; R 9 is hydrogen or an organic group having 1 or more carbon atoms and may be identical with or different from each other when “q” is an integer of 2 or more; at least one of R 1 to R 8 is the group having an alicyclic structure when R 0 is a single bond; at least one of R 1 to R 9 is the group having an alicyclic structure when R 0 has the structure represented by formula (2); and “*” and “**” represent a position to be bonded to a different chemical structure.

  本发明的主要目的是提供一种具有高耐热性和低介电常数的树脂组合物，其清漆，树脂膜以及使用该组合物的半导体器件。在本发明中，通过包括具有以下结构的化合物和交联剂的树脂组合物来实现该目标：其中在公式（1）中，R0是单键或具有以下结构的化合物（2）；R1到R8分别为氢、具有脂环结构的基团、具有1到10个碳原子的有机基团（不包括具有脂环结构的基团）、羟基和羧基中的任意一种；“X”是以下任意一种：—O—、—NHCO—、—CONH—、—COO—和—OCO—；此外，在公式（2）中，“Ar”是芳香族基团；“Y”是以下任意一种：单键—O—、—S—、—OCO—和—COO—；“q”是1或更多的整数；当“q”是2或更多的整数时，R9是氢或具有1个或更多碳原子的有机基团，并且可以相同或不同；当R0是单键时，R1到R8中至少有一个是具有脂环结构的基团；当R0具有以下结构的化合物（2）时，R1到R9中至少有一个是具有脂环结构的基团；“*”和“**”表示要与不同化学结构结合的位置。
• Resin Composition, Polyimide Resin Composition, Polybenzoxazole Resin Composition, Varnish, Resin Film and Semiconductor Device Using the Same
  申请人：Enoki Takashi

  公开号：US20080255335A1

  公开（公告）日：2008-10-16

  A resin composition having high heat resistance and low dielectric constant after heat treatment, a varnish thereof and a semiconductor device using the same are provided by a resin composition including a compound having a structure represented by the general formula (1): wherein, “Ar” is an aromatic group; “a” is 0 or 1; R 11 is an organic group having one or more carbon atoms and at least one is a group having an alicyclic structure; when “q” is an integer of 2 or more, R 11 s may be the same or different from each other; at least one of R 1 to R 5 and at least one of R 6 to R 10 on respective benzene rings are Ar-binding sites or R 11 -binding sites and the others of R 1 to R 5 and R 6 to R 10 are each hydrogen, a group having an alicyclic structure, an organic group having 1 to 10 carbon atoms, a hydroxyl group or a carboxyl group; when “a” is 0, at least one of R 1 to R 5 and R 6 to R 10 is a group having an alicyclic structure; “q” is an integer of 1 or more; and “X” is any of —O—, —NHCO—, —COHN—, —COO— and —OCO—.

  提供一种高热稳定性和低介电常数的树脂组合物，其在热处理后具有高热稳定性和低介电常数，以及其清漆和半导体器件。该树脂组合物包括具有以下通式（1）所表示结构的化合物：其中，“Ar”为芳香族基；“a”为0或1；R11为具有一个或多个碳原子的有机基，至少有一个是具有脂环结构的基团；当“q”为2或更多的整数时，R11可以相同或不同；R1至R5中的至少一个和R6至R10中的至少一个在各自的苯环上是Ar结合位点或R11结合位点，而R1至R5和R6至R10中的其他部分分别是氢、具有脂环结构的基团、具有1至10个碳原子的有机基、羟基或羧基；当“a”为0时，R1至R5和R6至R10中的至少一个是具有脂环结构的基团；“q”为1或更多的整数；而“X”为—O—、—NHCO—、—COHN—、—COO—和—OCO—中的任意一种。
• AROMATIC CARBOXYLIC ACIDS, ACID HALIDES THEREOF AND PROCESSES FOR PREPARING BOTH
  申请人：SUMITOMO BAKELITE CO., LTD.

  公开号：EP1346975A1

  公开（公告）日：2003-09-24

  A novel aromatic carboxylic acid useful as a material for macromolecular compounds and, in particular, for polycondensed macromolecular compounds exhibiting excellent heat resistance, an acid halide derivative thereof and a process for producing these compounds are disclosed. The aromatic carboxylic acid and the acid halide derivative thereof have structures represented general formulae (1) and (2), respectively, and can be efficiently produced from a dialkyl ester derivative of isophthalic acid and an acetylene derivative in accordance with the disclosed process comprising specific steps. In the above formulae, A represents:- C≡C-R1 or (R1 represents hydrogen atom, an alkyl group or an aromatic group, R2 represents an alkyl group or an aromatic group) and X represents a halogen atom.

  本发明公开了一种新型芳香族羧酸，可用作高分子化合物的材料，特别是用于具有优异耐热性的缩聚高分子化合物，还公开了其酸性卤化物衍生物以及生产这些化合物的工艺。芳香族羧酸及其酸性卤化物衍生物的结构分别代表通式（1）和（2），可根据所公开的包括特定步骤的工艺，从间苯二甲酸的二烷基酯衍生物和乙炔衍生物中有效地制取。 在上式中，A 代表：- C≡C-R1 或 (R1代表氢原子、烷基或芳香基，R2代表烷基或芳香基），X代表卤素原子。
• RESIN COMPOSITION, POLYIMIDE RESIN COMPOSITION, POLY- BENZOXAZOLE RESIN COMPOSITION, VARNISHES, RESIN FILMS AND SEMICONDUCTOR DEVICES MADE BY USING THE SAME
  申请人：Sumitomo Bakelite Company, Limited

  公开号：EP1813637A1

  公开（公告）日：2007-08-01

  A resin composition having high heat resistance and low dielectric constant after heat treatment, a varnish thereof and a semiconductor device using the same are provided by a resin composition comprising a compound having a structure represented by the general formula (1): wherein, "Ar" is an aromatic group; "a" is 0 or 1; R11 is an organic group having one or more carbon atoms and at least one is a group having an alicyclic structure; when "q" is an integer of 2 or more, R11s may be the same or different from each other; at least one of R1 to R5 and at least one of R6 to R10 on respective benzene rings are Ar-binding sites or R11-binding sites and the others of R1 to R5 and R6 to R10 are each hydrogen, a group having an alicyclic structure, an organic group having 1 to 10 carbon atoms, a hydroxyl group or a carboxyl group; when "a" is 0, at least one of R1 to R5 and R6 to R10 is a group having an alicyclic structure; "q" is an integer of 1 or more; and "X" is any of -O-, -NHCO-, -COHN-, -COO- and OCO-.

  提供了一种经热处理后具有高耐热性和低介电常数的树脂组合物、其清漆以及使用该树脂组合物的半导体器件，该树脂组合物由具有通式 (1) 所示结构的化合物组成： 其中，"Ar "是芳香族基团；"a "是 0 或 1；R11 是具有一个或多个碳原子的有机基团，且至少有一个是具有脂环结构的基团；当 "q "是 2 或 2 以上的整数时，R11s 可以相同或不同；在各自苯环上的 R1 至 R5 和 R6 至 R10 中，至少有一个是 Ar 结合位点或 R11 结合位点，R1 至 R5 和 R6 至 R10 中的其它各为氢、脂环结构基团、具有 1 至 10 个碳原子的有机基团、羟基或羧基；当 "a "为 0 时，R1 至 R5 和 R6 至 R10 中至少有一个是具有脂环结构的基团；"q "是 1 或 1 以上的整数；以及 "X "是-O-、-NHCO-、-COHN-、-COO-和 OCO-中的任意一种。