申请人:Heraeus Deutschland GmbH & Co. KG
公开号:US10073549B2
公开(公告)日:2018-09-11
The present invention relates to the production of a layer structure, comprising the following process steps:
i) coating a substrate with a composition at least comprising silver nanowires and a solvent;
ii) at least partial removal of the solvent, thereby obtaining a substrate that is coated with an electrically conductive layer, the electrically conductive layer at least comprising the silver nanowires;
iii) bringing into contact selected areas of the electrically conductive layer with an etching composition, thereby reducing the conductivity of the electrically conductive layer in these selected areas, wherein the etching composition comprises an organic compound capable of releasing chlorine, bromine or iodine, a compound containing hypochloride, a compound containing hypo-bromide or a mixture of at least two of these compounds.
The invention also relates to a layer structure obtainable by this method, a layer structure, the use of a layer structure, an electronic component and the use of an organic compound.
本发明涉及层状结构的生产,包括以下工艺步骤:
i) 在基底上涂覆至少包括纳米银线和溶剂的组合物;
ii) 至少部分去除溶剂,从而获得涂有导电层的基底,导电层至少包括纳米银丝;
iii) 使导电层的选定区域与蚀刻组合物接触,从而降低导电层在这些选定区域的导电性,其中蚀刻组合物包括能够释放氯、溴或碘的有机化合物、含有次氯酸盐的化合物、含有次溴化物的化合物或至少两种此类化合物的混合物。
本发明还涉及可通过该方法获得的层结构、层结构、层结构的使用、电子元件和有机化合物的使用。