4’4’-bis(4-carboxybenzylidene)diaminodiphenyl ether diglycidyl ester

• 分子结构分类: 有机化合物 - 苯类化合物 - 苯和取代衍生物
• 英文名称: 4’4’-bis(4-carboxybenzylidene)diaminodiphenyl ether diglycidyl ester
• 英文别名: Oxiran-2-ylmethyl 4-[[4-[4-[[4-(oxiran-2-ylmethoxycarbonyl)phenyl]methylideneamino]phenoxy]phenyl]iminomethyl]benzoate；oxiran-2-ylmethyl 4-[[4-[4-[[4-(oxiran-2-ylmethoxycarbonyl)phenyl]methylideneamino]phenoxy]phenyl]iminomethyl]benzoate
• 化学式: C₃₄H₂₈N₂O₇
• 分子量: 576.606
• InChiKey: XLMJPEQMMNWUJZ-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  5.1
• 重原子数：
  43
• 可旋转键数：
  14
• 环数：
  6.0
• sp3杂化的碳原子比例：
  0.18
• 拓扑面积：
  112
• 氢给体数：
  0
• 氢受体数：
  9

反应信息

• 作为产物：
  描述：

  4’4’-bis(4-carboxybenzylidene)diaminodiphenyl ether 、 环氧氯丙烷 在 四丁基溴化铵 作用下， 以 N,N-二甲基乙酰胺 为溶剂， 反应 6.0h， 以80%的产率得到4’4’-bis(4-carboxybenzylidene)diaminodiphenyl ether diglycidyl ester
  参考文献：
  名称：

  Thermal Conductivity of Diglycidylester-Terminated Liquid Crystalline Epoxy/Alumina Composite

  摘要：

  We synthesized three novel diglycidylester-terminated liquid crystalline epoxy (LCE) resins containing various liquid crystalline backbones to investigate the thermal conductivity of composites filled with alumina (Al2O3) particles and the results are compared to that of the composite with diglycidylether-terminated LCE resin which differs only in the structure of terminal epoxy linkage. The results showed that LCE resins displayed distinct nematic liquid crystalline phases at wide temperature ranges and all cured systems exhibited well-reserved nematic phases. The thermal conductivity of novel diglycidylester-terminated LCE resin containing composite is higher than that of diglycidylether-terminated LCE resin containing composite.

  DOI：

  10.1080/15421406.2015.1107816

文献信息

• Epoxy resin composite and printed circuit board comprising insulating layer using the same
  申请人：LG INNOTEK CO., LTD.

  公开号：US10280289B2

  公开（公告）日：2019-05-07

  An epoxy resin composition according to one embodiment of the present invention comprises an epoxy resin, a curing agent, and an inorganic filler, and the inorganic filler includes boron nitride on which a metal oxide film is formed.

  根据本发明的一个实施方案，环氧树脂组合物包括环氧树脂、固化剂和无机填料，无机填料包括氮化硼，在氮化硼上形成金属氧化物薄膜。
• Epoxy resin compound and radiant heat circuit board Using the same
  申请人：LG Innotek Co., Ltd.

  公开号：EP2698400B1

  公开（公告）日：2020-09-30
• EPOXY RESIN COMPOUND AND RADIANT HEAT CIRCUIT BOARD USING THE SAME
  申请人：LG INNOTEK CO., LTD.

  公开号：US20140048316A1

  公开（公告）日：2014-02-20

  There is provided an epoxy resin compound including an epoxy resin including a crystalline epoxy, a curing agent, and an inorganic filler. Also, there is provided a radiant heat circuit board including a metal plate, an insulating layer formed on the metal plate; and a circuit pattern formed on the insulating layer, in which the insulting layer is formed by curing an epoxy resin compound including an epoxy resin including a crystalline epoxy, a curing agent, and an inorganic filler.
• EPOXY RESIN COMPOSITE AND PRINTED CIRCUIT BOARD COMPRISING INSULATING LAYER USING THE SAME
  申请人：LG INNOTEK CO., LTD.

  公开号：US20170051133A1

  公开（公告）日：2017-02-23

  An epoxy resin composition according to one embodiment of the present invention comprises an epoxy resin, a curing agent, and an inorganic filler, and the inorganic filler includes boron nitride on which a metal oxide film is formed.
• INORGANIC FILLER, EPOXY RESIN COMPOSITION INCLUDING THE SAME AND LIGHT EMITTING ELEMENT INCLUDING INSULATING LAYER USING THE COMPOSITION
  申请人：LG INNOTEK CO., LTD.

  公开号：US20170130033A1

  公开（公告）日：2017-05-11

  An inorganic filler included in an epoxy resin composition includes a coating layer formed on a surface thereof, and the surface of the coating layer includes at least two elements selected from the group consisting of C, N and O.