COMPOSITION, THERMALLY CONDUCTIVE SHEET, AND DEVICE WITH THERMALLY CONDUCTIVE LAYER
申请人:FUJIFILM Corporation
公开号:US20210301180A1
公开(公告)日:2021-09-30
A composition contains an inorganic nitride, and a compound represented by General
COMPOSITION FOR FORMING THERMALLY CONDUCTIVE MATERIAL, THERMALLY CONDUCTIVE MATERIAL, AND SURFACE-MODIFIED INORGANIC SUBSTANCE
申请人:FUJIFILM Corporation
公开号:US20220135861A1
公开(公告)日:2022-05-05
The present invention provides a composition for forming a thermally conductive material, from which a thermally conductive material having excellent adhesiveness can be obtained. In addition, the present invention provides a thermally conductive material and a surface-modified inorganic substance.
The composition for forming a thermally conductive material of the present invention is a composition for forming a thermally conductive material containing a surface-modified inorganic substance and a thermosetting compound, the surface-modified inorganic substance satisfying at least one of Requirement 1 or Requirement 2.
Requirement 1: The surface-modified inorganic substance includes a surface-modified inorganic substance X containing the inorganic substance, and a surface modifier A and a surface modifier B adsorbed on a surface of the inorganic substance.
Requirement 2: The surface-modified inorganic substance includes a surface-modified inorganic substance A containing the inorganic substance and the surface modifier A adsorbed on the surface of the inorganic substance, and a surface-modified inorganic substance B containing the inorganic substance and the surface modifier B adsorbed on the surface of the inorganic substance.
MANUFACTURING METHOD FOR THERMAL CONDUCTIVE LAYER, MANUFACTURING METHOD FOR LAMINATE, AND MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE
申请人:FUJIFILM Corporation
公开号:US20220216126A1
公开(公告)日:2022-07-07
There is provided a manufacturing method for a thermal conductive layer, with which a thermal conductive layer having a thermal diffusivity of 3.0×10
−7
m
2
s
−1
or more is manufactured on a support by using a composition for forming a thermal conductive layer, the composition containing a resin, a filler, and a solvent and having a concentration of solid contents of less than 90% by mass, the manufacturing method including a discharge step of discharging the composition toward the support; and a solvent amount reduction step of reducing a solvent amount in the composition such that a first solvent amount reduction time taken after the composition is discharged until the concentration of solid contents in the composition reaches 90% by mass on the support is 10 seconds or more for each position on the support.