1,3-bis(4-maleimidophenoxy)-benzene

• 分子结构分类: 有机化合物 - 苯类化合物 - 苯和取代衍生物
• 英文名称: 1,3-bis(4-maleimidophenoxy)-benzene
• 英文别名: 1,3-bis(4-maleimidylphenoxy)benzene；1,3-bis(4-maleimidophenoxy)benzene；1-[4-[3-[4-(2,5-dioxopyrrol-1-yl)phenoxy]phenoxy]phenyl]pyrrole-2,5-dione
• 化学式: C₂₆H₁₆N₂O₆
• 分子量: 452.423
• InChiKey: UGJHILWNNSROJV-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  3.2
• 重原子数：
  34
• 可旋转键数：
  6
• 环数：
  5.0
• sp3杂化的碳原子比例：
  0.0
• 拓扑面积：
  93.2
• 氢给体数：
  0
• 氢受体数：
  6

反应信息

• 作为产物：
  描述：

  马来酸酐 、 1,3-二(4-氨苯氧基)苯 在 对甲苯磺酸 作用下， 以 N,N-二甲基甲酰胺 、 甲苯 为溶剂， 反应 12.0h， 以94.2%的产率得到1,3-bis(4-maleimidophenoxy)-benzene
  参考文献：
  名称：

  SUBSTITUTED OR UNSUBSTITUTED ALLYL GROUP-CONTAINING MALEIMIDE COMPOUND, PRODUCTION METHOD THEREFOR, AND COMPOSITION AND CURED PRODUCT USING SAID COMPOUND

  摘要：

  亚苯基马来酰亚胺化合物，具有三个或更多苯环的结构，含有一个或多个取代或未取代的烯丙基团，以及一个或多个马来酰亚胺基团，具有卓越的耐热性。

  公开号：

  US20200325101A1

文献信息

• SUBSTITUTED OR UNSUBSTITUTED ALLYL GROUP-CONTAINING MALEIMIDE COMPOUND, PRODUCTION METHOD THEREFOR, AND COMPOSITION AND CURED PRODUCT USING SAID COMPOUND
  申请人：DIC CORPORATION

  公开号：US20200325101A1

  公开（公告）日：2020-10-15

  Bismaleimides (BMI) exhibit excellent heat resistance (high Tg and high resistance to thermal decomposition) compared to epoxy resins and phenolic resins, and therefore, in recent years, more attention is paid to bismaleimides as a resin material for the next-generation devices represented by SiC power semiconductors, in addition to the investigation on the use of bismaleimides for electronic material applications. As such, conventional BMI's are known as highly heat-resistant resins; however, there is a demand for a resin having higher heat resistance for advanced material applications and the like. Thus, an object of the invention is to provide a novel maleimide compound having superior heat resistance. Disclosed is a substituted or unsubstituted allyl group-containing maleimide compound having a structure with three or more benzene rings, having one or more groups each having a substituted or unsubstituted allyl group, and having one or more maleimide groups.

  亚苯基马来酰亚胺化合物，具有三个或更多苯环的结构，含有一个或多个取代或未取代的烯丙基团，以及一个或多个马来酰亚胺基团，具有卓越的耐热性。
• FILM FORMING MATERIAL FOR LITHOGRAPHY, COMPOSITION FOR FILM FORMATION FOR LITHOGRAPHY, UNDERLAYER FILM FOR LITHOGRAPHY, AND METHOD FOR FORMING PATTERN
  申请人：Mitsubishi Gas Chemical Company, Inc.

  公开号：US20210165327A1

  公开（公告）日：2021-06-03

  An object of the present invention is to provide a film forming material for lithography that is applicable to a wet process, and is useful for forming a photoresist underlayer film excellent in heat resistance, etching resistance, embedding properties to a supporting material having difference in level, and film flatness; and the like. The problem described above can be solved by the following film forming material for lithography. A film forming material for lithography comprising: a compound having a group of formula (0A): (In formula (0A), R A is a hydrogen atom or an alkyl group having 1 to 4 carbon atoms; and R B is an alkyl group having 1 to 4 carbon atoms.); and a compound having a group of formula (0B):

  本发明的目的是提供一种适用于湿法的光刻膜材料，用于形成具有良好耐热性、耐蚀性、嵌入性和膜平整度的光刻胶底层膜，以及支撑材料之间高度差异的问题。以上所述的问题可以通过以下的光刻膜材料来解决。一种光刻膜材料，包括：具有公式（0A）组的化合物：（在公式（0A）中，RA是氢原子或具有1至4个碳原子的烷基；RB是具有1至4个碳原子的烷基。）；以及具有公式（0B）组的化合物：
• THERMOSETTING COMPOSITION AND PRINTED CIRCUIT BOARD USING THE SAME
  申请人：JUNG Myung Sup

  公开号：US20100124037A1

  公开（公告）日：2010-05-20

  A thermosetting composition including an organic solvent, a liquid crystalline thermoset oligomer, and either a crosslinking agent or an epoxy resin or both is disclosed. A printed circuit board which includes the thermosetting composition is also disclosed. The printed circuit board is produced by impregnating the thermosetting composition into a reinforcing material.

  本发明公开了一种热固性组合物，包括有机溶剂、液晶热固性低聚物，以及交联剂或环氧树脂或两者都有。本发明还公开了一种包括该热固性组合物的印刷电路板。该印刷电路板是通过将该热固性组合物浸渍到增强材料中制造的。
• COMPOSITION FOR PRODUCING A BOARD AND PRINTED CIRCUIT BOARD USING THE SAME
  申请人：KIM Kwang Hee

  公开号：US20100139961A1

  公开（公告）日：2010-06-10

  A composition, including a liquid crystal polymer or oligomer having a terminal hydroxyl group, and a cross-linking agent including a bismaleimide compound, an epoxy resin or a combination thereof, wherein the liquid crystal polymer or oligomer is represented by Formula 1: Z 1 -(R 1 ) m —(R 2 ) n -Z 2 (1), wherein R 1 is represented by Formula 2: —X 1 —Ar 1 —Y 1 —  (2), wherein X 1 and Y 1 are each independently selected from the group consisting of O, CO and NR″, in which R″ is independently selected from the group consisting of a hydrogen atom, a substituted or unsubstituted C 1 -C 20 alkyl group, and a substituted or unsubstituted C 6 -C 30 aryl group, and Ar 1 includes at least one divalent aromatic or alicyclic organic group selected from the group consisting of Formula 3:

  本发明涉及一种组合物，包括具有端羟基的液晶聚合物或寡聚物以及包括双马来酰亚胺化合物、环氧树脂或其组合物的交联剂。其中，液晶聚合物或寡聚物由式1表示：Z1-(R1)m—(R2)n-Z2(1)，其中R1由式2表示：—X1—Ar1—Y1—  (2)，其中X1和Y1各自独立地选自O、CO和NR″的群，其中R″独立地选自氢原子、取代或未取代的C1-C20烷基和取代或未取代的C6-C30芳基的群，而Ar1包括至少一种从式3所选的双价芳香或脂环有机基团：
• CURABLE RESIN COMPOSITION AND CURED PRODUCT THEREOF
  申请人：Tsubuku Makoto

  公开号：US20130288063A1

  公开（公告）日：2013-10-31

  A curable resin composition which can achieve a cured product in which the generation of cracks upon curing is suppressed and which has both a low thermal expansion rate and a low water absorbability is provided. The curable resin composition comprises: at least a cyanate ester compound (A) represented by the following formula (I); a metal complex catalyst (B); and an additive (C), wherein the additive (C) contains any one or more selected from the group consisting of a compound represented by the following general formula (II), a compound represented by the following general formula (III), and a tertiary amine.

  提供一种可治愈的树脂组合物，可以实现在固化时抑制裂纹的产生，并具有低热膨胀率和低吸水性。该可治愈的树脂组合物包括：至少一种由以下化学式（I）表示的氰酸酯化合物（A）；一种金属络合催化剂（B）；和一种添加剂（C），其中添加剂（C）包含以下通式（II）表示的化合物、以下通式（III）表示的化合物或三级胺中的任意一种或多种。