OPTICAL COMPONENT FORMING COMPOSITION AND CURED PRODUCT THEREOF
申请人:Mitsubishi Gas Chemical Company, Inc.
公开号:US20200262787A1
公开(公告)日:2020-08-20
The present invention provides an optical component forming composition comprising a tellurium-containing compound or a tellurium-containing resin.
本发明提供了一种包括含碲化合物或含碲树脂的光学元件成型组合物。
MOLECULAR GLASS PHOTORESISTS CONTAINING BISPHENOL A FRAMEWORK AND METHOD FOR PREPARING THE SAME AND USE THEREOF
申请人:Yang Guoqiang
公开号:US20150037735A1
公开(公告)日:2015-02-05
The present invention provides a class of molecular glass photoresist (I and II) comprising bisphenol A as a main structure and their preparation. The molecular glass photoresist is formulated with a photoacid generator, a cross-linking agent, a photoresist solvent, and other additives into a positive or negative photoresist. A photoresist with a uniform thickness is formed on a silicon wafer by spin-coating. The photoresist formulation can be used in modern lithography, such as 248 nm photolithography, 193 nm photolithography, extreme-ultraviolet (EUV) lithography, nanoimprint lithography, electron beam lithography, and particularly in the EUV-lithography technique.
Chemically amplified resist, polymer for the chemically amplified resist, monomer for the polymer and method for transferring pattern to chemically amplified resist layer
申请人:NEC CORPORATION
公开号:US20030224297A1
公开(公告)日:2003-12-04
Chemically amplified resist is produced on the basis of vinyl polymer having 3-oxo-4-oxabicyclo[3.2.1]octane-2-yl group expressed by general formula (1)
1
where each of L
1
, L
2
, L
3
, L
4
, L
5
and L
6
is selected from the group consisting of hydrogen atom and alkyl groups having the carbon number from 1 to 8, and the hydrogen atom and/or the alkyl group at L
5
and L
6
are replaced with alkylene groups having the carbon number from 1 to 10 and bonded to each other for forming a ring so that the resist exhibits high transparency to light equal to or less than 220 nm wavelength, large resistance against dry etching and good adhesion to substrates.
Monomer having fluorine-containing acetalor ketal structure, polymer thereof, and chemical-amplification-type resist composition as well as process for formation of pattern with use of the same
申请人:Maeda Katsumi
公开号:US20050164119A1
公开(公告)日:2005-07-28
As a polymer exhibiting improved transparency which is suitable for a resist resin used in a chemical-amplification-type resist being applicable for photolithography using exposure light at 180 nm or shorter, this invention provides a polymer comprising a repeating unit resulting from polymerization of a monomer exhibiting a polymerization activity, wherein the monomer has a fluorine-containing acetal or ketal structure represented by general formula (1):
wherein
R represents an atomic group containing a carbon-carbon double bond exhibiting polymerization activity; at least one of R
1
and R
2
is fluorinated alkyl group or fluorinated aryl group having 1 to 20 carbon atoms; and R
3
represents a radical selected from the group consisting of hydrogen atom, alkyl group, alkoxy-substituted alkyl group, fluorinated alkyl group, aryl group, fluorinated aryl group, aralkyl group and fluorinated aralkyl group having 1 to 20 carbon atoms.
Chemical amplified resist, polymer for the chemically amplified resist, monomer for the polymer and method for transferring pattern to chemically amplified resist layer
申请人:NEC CORPORATION
公开号:US20030097008A1
公开(公告)日:2003-05-22
Chemically amplified resist is produced on the basis of vinyl polymer having 3-oxo-4-oxabicyclo [3.2.1 ]octane-2-yl group expressed by general formula (1)
1
where each of L
1
, L
2
, L
3
, L
4
, L
5
and L
6
is selected from the group consisting of hydrogen atom and alkyl groups having the carbon number from 1 to 8, and the hydrogen atom and/or the alkyl group at L
5
and L
6
are replaced with alkylene groups having the carbon number from 1 to 10 and bonded to each other for forming a ring so that the resist exhibits high transparency to light equal to or less than 220 nm wavelength, large resistance against dry etching and good adhesion to substrates.