POSITIVE RESIST COMPOSITION AND PATTERN FORMING METHOD USING THE SAME
申请人:HIRANO Shuji
公开号:US20080248419A1
公开(公告)日:2008-10-09
A positive resist composition, includes: (A) a resin that has a group having absorption at 248 nm at a main chain terminal of the resin (A), and a pattern forming method uses the composition.