UV curable compositions suitable for use as potting and encapsulating compounds for electrical and electronic devices are provided. The compositions comprise: (a) a UV curable compound polymerizable by a free radical process and containing reactive unsaturated groups, (b) a polysilane photoinitiator, and (c) a peroxide or azo compound photoinitiator or mixture of peroxide and azo compound photoinitiators. The use of the two photoinitiators enables one to get a more complete cure, both at the surface and deep into the coating.
本发明提供了适用于电气和电子设备的灌封和封装化合物的紫外线固化组合物。这些组合物包括:(a) 可通过自由基工艺聚合并含有活性不饱和基团的紫外线固化化合物,(b) 聚
硅烷光
引发剂,(c) 过
氧化物或偶
氮化合物光
引发剂或过
氧化物和偶
氮化合物光
引发剂的混合物。使用这两种光
引发剂可以使涂层表面和深处的固化更加彻底。