申请人:NITTO DENKO CORPORATION
公开号:EP1944001A1
公开(公告)日:2008-07-16
The present invention provides a patch package structure, which includes: a package including a first sheet material which is planar and a second sheet material which has been molded, the first and second sheet materials being sealed together in peripheral parts thereof, and a patch disposed in the package, in which the patch contains a backing, a pressure-sensitive adhesive layer laminated on at least one side of the backing, and a release liner which protects a pressure-sensitive adhesive surface of the pressure-sensitive adhesive layer; the second sheet material has been molded so as to have a protrudent part in at least a substantially central area thereof, the protrudent part having a planar outer shape larger than a planar outer shape of the release liner and having at least one recessed part; d is not smaller than T, in which d is the minimum gap distance between the inner surface of the first sheet material and the inner surface of the second sheet material at the recessed part and T is a thickness of the patch; and, at the boundary between the sealed part where the first and second sheet materials are sealed together and an unsealed part, the outer surface of the second sheet material rises at an obtuse angle.
本发明提供了一种贴片封装结构,它包括一种包装,包括平面的第一片状材料和模制的第二片状材料,第一片状材料和第二片状材料在其周边部分密封在一起,以及一种贴片,贴片放置在包装中,其中贴片包含衬底、层压在衬底至少一面的压敏胶层和保护压敏胶层压敏胶表面的离型衬垫;第二种片状材料经过模压,至少在其大致中心区域具有一个突起部分,该突起部分的平面外部形状大于离型衬垫的平面外部形状,并具有至少一个凹陷部分;d 不小于 T,其中 d 是第一片状材料的内表面与第二片状材料的内表面在凹陷部分的最小间隙距离,T 是贴片的厚度;以及,在第一片状材料和第二片状材料密封在一起的密封部分与未密封部分之间的边界处,第二片状材料的外表面呈钝角上升。