申请人:Nitto Denko Corporation
公开号:EP2733087A2
公开(公告)日:2014-05-21
A purpose of the present invention is to provide a packaging structure for a patch, in which the patch can be easily taken out of a package body. The packaging structure (100) for a patch includes a first and second base materials (120, 130) which have a peripheral edge part laminated with each other, and the patch is included therein. The first and second base materials (120, 130) have a first to forth sides (121 to 124, 131 to 134). At least one of the first and second base materials (120, 130) has a first to third opening parts (125 to 127, 135 to 137). The first to third opening parts (125 to 127, 135 to 137) guides so as to open toward the inner peripheral edge (120c1, 120c2, 120c4, 130c1, 130c2, 130c4) of the sealing part (120c, 130c).
本发明的目的是提供一种用于贴片的包装结构,其中的贴片可以很容易地从包装体中取出。用于贴片的包装结构(100)包括第一和第二基材(120、130),它们的外围边缘部分相互层压,贴片包含在其中。第一和第二基材(120、130)具有第一至第四侧(121 至 124、131 至 134)。第一和第二基底材料(120、130)中至少有一个具有第一至第三开口部分(125 至 127、135 至 137)。第一至第三开口部件(125 至 127、135 至 137)导向密封部件(120c、130c)的内周边缘(120c1、120c2、120c4、130c1、130c2、130c4)。