1,1'-(磺酰基二-3,1-苯基)双-1H-吡咯-2,5-二酮 | 68555-55-5

• 分子结构分类: 有机化合物 - 有机杂环化合物 - 吡咯啉
• 中文名称: 1,1'-(磺酰基二-3,1-苯基)双-1H-吡咯-2,5-二酮
• 中文别名: 1,1'-(磺酰基二-3,1-亚苯基)二-1H-吡咯-2,5-二酮
• 英文名称: 1H-Pyrrole-2,5-dione, 1,1'-(sulfonyldi-3,1-phenylene)bis-
• 英文别名: 1-[3-[3-(2,5-dioxopyrrol-1-yl)phenyl]sulfonylphenyl]pyrrole-2,5-dione
• CAS: 68555-55-5
• 化学式: C₂₀H₁₂N₂O₆S
• 分子量: 408.4
• InChiKey: RNSJLHIBGRARKK-UHFFFAOYSA-N

物化性质

• 稳定性/保质期：

  远离氧化物、光和热。

计算性质

• 辛醇/水分配系数(LogP)：
  1
• 重原子数：
  29
• 可旋转键数：
  4
• 环数：
  4.0
• sp3杂化的碳原子比例：
  0.0
• 拓扑面积：
  117
• 氢给体数：
  0
• 氢受体数：
  6

反应信息

• 作为产物：
  描述：

  马来酸酐 生成 1,1'-(磺酰基二-3,1-苯基)双-1H-吡咯-2,5-二酮
  参考文献：
  名称：

  OBUTI, SEDZI;OBAYASI, TADASI;MURAI, NOBUYUKI;MATSUNO, XIROAKI

  摘要：

  DOI：

文献信息

• [EN] [(2-ETHOXY-5-TRANS-1-PROPEN-1-YL)-PHENOXYL]-TERMINATED COMPOUNDS<br/>[FR] COMPOSÉS À TERMINAISON [(2-ÉTHOXY-5-TRANS-1-PROPÉN-1-YL)-PHÉNOXYLE]
  申请人：EVONIK TECHNOCHEMIE GMBH

  公开号：WO2017045931A1

  公开（公告）日：2017-03-23

  The present invention relates to compounds according to formula (I) and to heat-curable resin compositions based on polymaleimide resin systems comprising such compounds as co-monomers:, (I) wherein Dis an x-functional group; and x is an integer ≥ 2; with the proviso that the x-functional group D is not a polycarbonate with an average molar mass in the range of 15000 g/mol to 150000 g/mol. The present invention also relates to crosslinked resins obtainable by curing such compositions. Compounds of the present invention can be used amongst others in fields like structural adhesives, matrix resins for fiber prepregs, moulding compounds, as well as structural and/or electrical composites.

  本发明涉及按照式（I）的化合物以及基于聚马来酰亚胺树脂体系的热固性树脂组合物，其中这些化合物作为共聚单体：（I）其中D是一个x官能团；x是大于等于2的整数；但需注意x官能团D不是具有平均摩尔质量在15000克/摩尔至150000克/摩尔范围内的聚碳酸酯。本发明还涉及通过固化这些组合物获得的交联树脂。本发明的化合物可以在结构胶、纤维预浸料的基体树脂、成型复合材料以及结构和/或电气复合材料等领域中使用。
• [EN] THERMOSETTING RESIN COMPOSITIONS<br/>[FR] COMPOSITIONS DE RÉSINE THERMODURCISSABLE
  申请人：HEXCEL COMPOSITES LTD

  公开号：WO2017108946A1

  公开（公告）日：2017-06-29

  Meta and para alkenyl phenols are reacted with hydroxyl benzophenone to produce compounds of the genera formula or which are used as curatives for polymaleimide resins.

  甲基和对烯基酚与羟基苯甲酮反应，产生通式化合物，用作聚马来酰亚胺树脂的固化剂。
• [EN] ALKENYLPHENOXY-SUBSTITUTED 1,1-DIPHENYLETHYLENES, PROCESSES FOR THEIR PREPARATION, AND THEIR USE<br/>[FR] 1,1-DIPHÉNYLÉTHYLÈNES SUBSTITUÉS PAR UN ALCÉNYLPHÉNOXY, LEURS PROCÉDÉS DE PRÉPARATION ET LEUR UTILISATION
  申请人：EVONIK TECHNOCHEMIE GMBH

  公开号：WO2017045932A1

  公开（公告）日：2017-03-23

  The present invention relates to compounds according to formula (I) and to heat-curable compositions based on polymaleimide resin systems comprising such compounds as co-monomers: wherein R1 is hydrogen or an alkenylphenoxy group, R2 is an alkenylphenoxy group, and R3 is hydrogen or an alkyl group with 1 to 4 carbon atoms. The present invention also relates to crosslinked resins obtainable by curing such compositions. Compounds of the present invention can be used amongst others in fields like structural adhesives, matrix resins for fiber prepregs, moulding compounds, as well as structural and/or electrical composites.

  本发明涉及根据式(I)的化合物以及基于聚马来酰亚胺树脂体系的热固性组合物，其中这些化合物作为共聚单体：其中R1是氢或烯基苯氧基，R2是烯基苯氧基，R3是氢或具有1至4个碳原子的烷基基团。本发明还涉及通过固化这种组合物获得的交联树脂。本发明的化合物可以在结构粘合剂、纤维预浸料的基质树脂、成型复合材料以及结构和/或电气复合材料等领域中使用。
• [EN] ASYMMETRICALLY SUBSTITUTED BIS-ALKENYL DIPHENYL ETHERS, THEIR PREPARATION AND USE<br/>[FR] ÉTHERS DE BIS-ALCÉNYLE DIPHÉNYLE SUBSTITUÉS DE MANIÈRE ASYMÉTRIQUE, LEUR PRÉPARATION ET LEUR UTILISATION
  申请人：EVONIK TECHNOCHEMIE GMBH

  公开号：WO2018091253A1

  公开（公告）日：2018-05-24

  The present invention relates to compounds according to formula (I) and to heat-curable resin compositions based on polymaleimide resin systems comprising such compounds as co-monomers: wherein R1 signifies an 1-alkenyl- or 2-alkenyl group with 3 to 6 carbon atoms, wherein R2 signifies hydrogen or an alkoxy group with up to 2 carbon atoms, wherein R3 signifies hydrogen or an alkyl group with up to 4 carbon atoms, and wherein R4 signifies hydrogen or an alkyl group with up to 4 carbon atoms. The present invention also relates to crosslinked resins obtainable by curing such compositions. Compounds of the present invention can be used amongst others in fields like structural adhesives, matrix resins for fiber prepregs, moulding compounds, as well as structural and/or electrical composites.

  本发明涉及按照式（I）的化合物以及基于聚马来酰亚胺树脂体系的热固性树脂组合物，其中这些化合物作为共聚单体：其中R1表示具有3到6个碳原子的1-烯基或2-烯基基团，R2表示氢或具有最多2个碳原子的烷氧基团，R3表示氢或具有最多4个碳原子的烷基团，R4表示氢或具有最多4个碳原子的烷基团。本发明还涉及通过固化这些组合物获得的交联树脂。本发明的化合物可用于结构胶粘剂、纤维预浸料基体树脂、成型复合材料以及结构和/或电气复合材料等领域。
• Curable Bisimide Resin Mixtures
  申请人：Technochemie GmbH - Verfahrenstechnik

  公开号：EP0141612A2

  公开（公告）日：1985-05-15

  1) Curable bisimide resins comprise a mixture of a) 5 to 95% of at least one bisimide of the general formula I in which 8 represents a divalent radical containing a carbon-carbon double bond and A is a divalent radical containing at least two carbon atoms and b) 95 to 5% of a polyhydantoin polymer of formula II wherein R1 represents an aromatic hydrocarbon radical, R2 represents hydrogen or an alkyl group having 1 to 6 carbon atoms, R3 represents an aromatic hydrocarbon radical, an alkyl radical having 4 to 10 carbon atoms optionally interrupted by one or more oxygen or sulphur atoms.

  1) 可固化双亚胺树脂由以下混合物组成 a) 5%至 95%的至少一种通式 I 的双亚胺 其中 8 代表含有碳碳双键的二价基，A 是至少含有两个碳原子的二价基，以及 b) 95%至 5%的式 II 的聚海因聚合物 其中 R1 代表芳香烃基，R2 代表氢或具有 1 至 6 个碳原子的烷基，R3 代表芳香烃基，具有 4 至 10 个碳原子的烷基，可选择被一个或多个氧原子或硫原子打断。