A one-part curable epoxy adhesive composition is provided. The adhesive comprises curable epoxy resin, a latent curative system comprising (a) at least one first curative encapsulated in thermoplastic polymeric microcapsules and (b) a second latent curative admixed in the curable epoxy resin, and sufficient particulate thermoplastic polymeric material to at least partially regionally plasticize the cured epoxy resin wherein up to all of the particulate thermoplastic polymeric material may be provided by the walls of the microcapsules. A method of curing the adhesive by heating the composition is also provided. A joint made by adhering members together with the adhesive composition and a method of making the joint are also provided.
提供一种单组份可固化环氧粘合剂组合物。该粘合剂包括可固化环氧
树脂,潜伏固化系统包括(a)至少一个第一固化剂封装在热塑性聚合物微胶囊中,以及(b)混合在可固化环氧
树脂中的第二个潜伏固化剂,以及足够的颗粒热塑性聚合物材料,至少部分地区域性塑化固化的环氧
树脂,其中所有颗粒热塑性聚合物材料都可以由微胶囊的壁提供。还提供了通过加热组合物来固化粘合剂的方法。还提供了使用粘合剂组合物将零件粘合在一起的接头以及制造接头的方法。