1,4-二(2-乙基己基)磺酸基琥珀酸酯铵盐 | 30673-56-4

• 分子结构分类: 有机化合物 - 脂质和类脂质分子 - 脂肪酰基
• 中文名称: 1,4-二(2-乙基己基)磺酸基琥珀酸酯铵盐
• 英文名称: Azanium,1,4-bis(2-ethylhexoxy)-1,4-dioxobutane-2-sulfonate
• 英文别名: azane;1,4-bis(2-ethylhexoxy)-1,4-dioxobutane-2-sulfonic acid
• CAS: 30673-56-4
• 化学式: C20H41NO7S
• 分子量: 439.6
• InChiKey: BWSNWGNFRMLBCY-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  4.19
• 重原子数：
  29
• 可旋转键数：
  17
• 环数：
  0.0
• sp3杂化的碳原子比例：
  0.9
• 拓扑面积：
  119
• 氢给体数：
  1
• 氢受体数：
  7

文献信息

• (METH)ACRYLATE POLYMER, A RESIN COMPOSITION AND A SHAPED ARTICLE
  申请人：Wakita Tsuneki

  公开号：US20120123023A1

  公开（公告）日：2012-05-17

  Disclosed is a (meth)acrylate polymer having a volume average primary particle size of 0.520 to 3.00 μm, a peak temperature of tan δ in the range of −100 to 0° C., determined with dynamic viscoelasticity measurement, of −40° C. or below, a peak height of tan δ in the range of −100 to 0° C., determined with dynamic viscoelasticity measurement, of 0.300 or more, and an acetone-insoluble component of 99% by mass of more. This polymer has excellent dispersibility of primary particles in a resin, excellent storage stability of a resin composition obtained, and excellent insulating properties and reduction in elastic modulus of a molded article obtained.

  本发明涉及一种（甲基）丙烯酸酯聚合物，其体积平均主粒子大小为0.520至3.00μm，tanδ在−100至0℃范围内的峰值温度，通过动态粘弹性测量确定为−40℃或更低，tanδ在−100至0℃范围内的峰值高度，通过动态粘弹性测量确定为0.300或更高，且丙酮不溶组分为质量的99%以上。该聚合物具有在树脂中主粒子的优异分散性，所得树脂组合物的优异储存稳定性，以及所得成型品的优异绝缘性和弹性模量降低。
• (METH)ACRYLATE POLYMER, RESIN COMPOSITION, AND MOLDED ARTICLE
  申请人：Mitsubishi Rayon Co., Ltd.

  公开号：EP2407497A1

  公开（公告）日：2012-01-18

  Disclosed is a (meth)acrylate polymer having a volume average primary particle size of 0.520 to 3.00 µm, a peak temperature of tan δ in the range of -100 to 0°C, determined with dynamic viscoelasticity measurement, of -40°C or below, a peak height of tan δ in the range of -100 to 0°C, determined with dynamic viscoelasticity measurement, of 0.300 or more, and an acetone-insoluble component of 99% by mass of more. This polymer has excellent dispersibility of primary particles in a resin, excellent storage stability of a resin composition obtained, and excellent insulating properties and reduction in elastic modulus of a molded article obtained.

  本发明公开了一种(甲基)丙烯酸酯聚合物，其体积平均初级粒径为 0.520 至 3.00 µm，通过动态粘弹性测量确定的-100 至 0°C 范围内 tan δ 的峰值温度为-40°C 或以下，通过动态粘弹性测量确定的-100 至 0°C 范围内 tan δ 的峰高为 0.300 或以上，丙酮不溶组分的质量百分比为 99% 或以上。 这种聚合物在树脂中具有极佳的初级粒子分散性，获得的树脂组合物具有极佳的储存稳定性，获得的模塑制品具有极佳的绝缘性能和弹性模量降低性能。
• POLYMER POWDER, CURABLE RESIN COMPOSITION, AND CURED PRODUCT THEREOF
  申请人：Mitsubishi Rayon Co., Ltd.

  公开号：EP2796482A1

  公开（公告）日：2014-10-29

  A polymer powder (P) selected from a group consisting of (i) a polymer powder (P1) and (ii) a polymer powder (P2) is provided. The (i) polymer powder (P1) includes a (meth)acrylate-based polymer (A1) having a glass transition temperature of 0 °C or less, and the polymer powder has an acetone-soluble component of 5 mass% or more. The acetone-soluble component has a mass average molecular weight of 100,000 or more. The (ii) polymer powder (P2) has an acetone-soluble component of 2 mass% to 35 mass%, the acetone-soluble component has a mass average molecular weight of 100,000 or more, and has a volume average primary particle size (Dv) of 200 nm or more.

  聚合物粉末（P）选自 (i) 聚合物粉末（P1）和 (ii) 聚合物粉末（P2）。 (i) 聚合物粉末 (P1) 包括玻璃化转变温度为 0 °C 或更低的(甲基)丙烯酸酯基聚合物 (A1)，且该聚合物粉末中的丙酮可溶组分为 5 质量%或更多。 丙酮可溶组分的质量平均分子量为 100,000 或以上。 (ii)聚合物粉末（P2）的丙酮可溶组分为 2 质量％至 35 质量％，丙酮可溶组分的质量平均分子量为 100,000 或以上，体积平均主粒径（Dv）为 200 nm 或以上。
• POLYMER POWDER, CURABLE RESIN COMPOSITION AND CURED MATERIAL THEREOF
  申请人：Mitsubishi Chemical Corporation

  公开号：EP3263612A1

  公开（公告）日：2018-01-03

  A polymer powder (P) being a polymer powder (P2) is provided. The polymer powder (P2) has an acetone-soluble component of 2 mass% to 35 mass%, the acetone-soluble component has a mass average molecular weight of 100,000 or more, and has a volume average primary particle size (Dv) of 200 nm or more.

  提供了一种聚合物粉末（P），即聚合物粉末（P2）。该聚合物粉末（P2）的丙酮可溶组分含量为 2 质量%至 35 质量%，丙酮可溶组分的质量平均分子量为 100,000 或以上，体积平均主粒径（Dv）为 200 nm 或以上。
• Process and apparatus for removing residues from semiconductor substrates
  申请人：Fulton L. John

  公开号：US20050183740A1

  公开（公告）日：2005-08-25

  The present invention generally relates to a system for cleaning substrates. More particularly, the present invention relates to process(es) for effecting chemical removal of residues from semiconductor substrates, including silicon wafers, using a system of reactive reverse micelle(s) or microemulsions in a densified carbon dioxide matrix. Various reactive chemical agents in the reactive micelle system may be used to effect cleaning and removal of etch and metal residues to levels sufficient for commercial wafer production and processing.

  本发明一般涉及一种清洗基片的系统。更具体地说，本发明涉及利用致密二氧化碳基质中的反应性反向胶束或微乳剂系统对半导体基质（包括硅晶片）上的残留物进行化学清除的工艺。反应胶束系统中的各种反应化学剂可用于清洗和去除蚀刻和金属残留物，使其达到足以进行商业晶片生产和加工的水平。