This invention is concerned with photosensitive polymer compositions useful in the preparation of printed circuit boards, lithographic printing plates, cathode ray tubes, as well as in chemical milling, solder resist and planarizing layer applications. The photosensitive polymer compositions comprise a crosslinkable photosensitive polymer composition, which comprises (a) photoinitiator, and (b) at least one polymer having one or more carrier groups per polymer molecule, and wherein the composition contains unsaturated groups so that it is capable, upon exposure to actinic radiation, of forming a film containing crosslinked polymer. The photosensitive polymer compositions, conveniently in the form of aqueous solutions or emulsions, are capable of being electrophoretically deposited as adherent, uniform, photosensitive films on conductive surfaces.
Films formed from the photosensitive polymer compositions can be aqueous developable and resistant to strong inorganic acids and strong bases.
本发明涉及可用于制备印刷电路板、平版印刷板、阴极射线管以及
化学研磨、阻焊剂和平面化层应用的光敏聚合物组合物。光敏聚合物组合物包括一种可交联的光敏聚合物组合物,该组合物包含 (a) 光
引发剂和 (b) 至少一种聚合物,每种聚合物分子具有一个或多个载体基团,其中该组合物包含不饱和基团,使其在暴露于光辐射后能够形成含有交联聚合物的薄膜。这种光敏聚合物组合物通常以
水溶液或乳液的形式存在,能够以粘附、均匀、光敏薄膜的形式电泳沉积在导电表面上。
由光敏聚合物组合物形成的薄膜可在
水溶液中显影,并可耐受强
无机酸和强碱。