1-己酰氮丙啶 | 45776-10-1

• 分子结构分类: 有机化合物 - 有机酸及其衍生物 - 羧酸及其衍生物
• 中文名称: 1-己酰氮丙啶
• 英文名称: Aziridine, 1-hexanoyl-
• 英文别名: 1-(aziridin-1-yl)hexan-1-one
• CAS: 45776-10-1
• 化学式: C₈H₁₅NO
• 分子量: 141.21
• InChiKey: KFUCFNVEDNPNRD-UHFFFAOYSA-N

物化性质

• 沸点：
  258.27°C (rough estimate)
• 密度：
  0.9938 (rough estimate)

计算性质

• 辛醇/水分配系数(LogP)：
  1.4
• 重原子数：
  10
• 可旋转键数：
  4
• 环数：
  1.0
• sp3杂化的碳原子比例：
  0.88
• 拓扑面积：
  20.1
• 氢给体数：
  0
• 氢受体数：
  1

文献信息

• COMPOSITION FOR SILICON WAFER POLISHING LIQUID
  申请人：Kao Corporation

  公开号：US20150111383A1

  公开（公告）日：2015-04-23

  A polishing liquid composition for a silicon wafer, wherein the composition comprises silica particles (component A), at least one kind of nitrogen-containing basic compound (component B) selected from an amine compound and an ammonium compound, and a water-soluble macromolecular compound (component C) that contains 10 wt % or more of a constitutional unit I represented by a general formula (1) below and has a weight average molecular weight of 50,000 or more and 1,500,000 or less; and the pH at 25° C. is 8.0 to 12.0. In the general formula (1), R 1 and R 2 each independently represents a hydrogen, a C1 to C8 alkyl group, or a C1 to C2 hydroxyalkyl group, and R 1 and R 2 are never both hydrogens.

  一种用于硅晶片的抛光液组合物，其中该组合物包括二氧化硅颗粒（组分A），至少一种含氮碱性化合物（组分B）选自胺化合物和铵化合物，以及一种水溶性高分子化合物（组分C），该高分子化合物包含10重量％或更多的由下式（1）表示的结构单元I，并且具有50,000或更多且1,500,000或更少的重均分子量；在25°C时的pH值为8.0至12.0。在式（1）中，R1和R2分别独立表示氢、C1至C8烷基或C1至C2羟基烷基，并且R1和R2永远不是两个氢原子。
• POLISHING LIQUID COMPOSITION FOR SILICON WAFERS
  申请人：Kao Corporation

  公开号：EP2444996A1

  公开（公告）日：2012-04-25

  A polishing composition for a silicon wafer, includes a macromolecular compound, an abrasive, and an aqueous medium. The macromolecular compound includes a constitutional unlit (a1) represented by the following general formula (1), a constitutional unit (a2) represented by the following general formula (2), and a constitutional unit (a3) represented by the following general formula (3). The total of the constitutional unit (a3) is 0.001 to 1.5 mol% of all the constitutional units of the macromolecular compound.

  一种用于硅晶片的抛光组合物，包括高分子化合物、研磨剂和水介质。大分子化合物包括由以下通式（1）表示的构型单体（a1）、由以下通式（2）表示的构型单元（a2）和由以下通式（3）表示的构型单元（a3）。结构单元（a3）的总量占该大分子化合物所有结构单元的 0.001 至 1.5 摩尔%。
• POLISHING COMPOSITION, METHOD FOR PRODUCING POLISHING COMPOSITION, AND KIT FOR PREPARING POLISHING COMPOSITION
  申请人：Fujimi Incorporated

  公开号：EP2977423A1

  公开（公告）日：2016-01-27

  Provided are a polishing composition comprising a water-soluble polymer that has a molecular structure comprising a plurality of repeat unit species having different SP values and a polishing composition exhibiting an etching rate and an abrasive adsorption in prescribed ranges when determined by prescribed methods. Also provided is a method for producing a polishing composition, using an abrasive, a basic compound, a water-soluble polymer having an alkaline-hydrolytic functional group, and water. The method comprises a step of obtaining an agent A comprising at least the basic compound and a step of obtaining an agent B comprising at least the water-soluble polymer H.

  本发明提供了一种抛光组合物，该抛光组合物包含一种水溶性聚合物，该聚合物的分子结构由具有不同 SP 值的多个重复单元种类组成；还提供了一种抛光组合物，该抛光组合物通过规定的方法确定蚀刻率和磨料吸附率时，蚀刻率和磨料吸附率均在规定的范围内。此外，还提供了一种使用研磨剂、碱性化合物、具有碱水解官能团的水溶性聚合物和水生产抛光组合物的方法。该方法包括获得至少包含碱性化合物的制剂 A 的步骤和获得至少包含水溶性聚合物 H 的制剂 B 的步骤。
• POLISHING COMPOSITION, PRODUCTION METHOD FOR POLISHING COMPOSITION, AND PRODUCTION METHOD FOR POLISHED ARTICLE
  申请人：Fujimi Incorporated

  公开号：EP2957613A1

  公开（公告）日：2015-12-23

  The present invention provides a polishing composition comprising an abrasive, a water-soluble polymer and water. The polishing composition has a volume average particle diameter DA of grains in the polishing composition of 20 nm to 60 nm measured by dynamic light scattering at a concentration equivalent to 0.2 % abrasive content by mass.

  本发明提供了一种由磨料、水溶性聚合物和水组成的抛光组合物。通过动态光散射测量，抛光组合物中颗粒的体积平均粒径 DA 为 20 nm 至 60 nm，浓度相当于 0.2 % 的研磨剂含量（质量百分比）。
• POLISHING COMPOSITION AND METHOD FOR MANUFACTURING POLISHED ARTICLE
  申请人：Fujimi Incorporated

  公开号：EP2960314A1

  公开（公告）日：2015-12-30

  This invention provides a polishing composition comprising an abrasive, a water-soluble polymer and water. The water-soluble polymer comprises a polymer A having an adsorption ratio of lower than 5 % and a polymer B having an adsorption ratio of 5 % or higher, but lower than 95 % based on a prescribed adsorption ratio measurement. Herein, the polymer B is selected from polymers excluding hydroxyethyl celluloses.

  本发明提供了一种抛光组合物，它由磨料、水溶性聚合物和水组成。水溶性聚合物包括吸附率低于 5%的聚合物 A 和根据规定的吸附率测量吸附率为 5%或更高但低于 95%的聚合物 B。其中，聚合物 B 选自不包括羟乙基纤维素的聚合物。