2,6-二氯-4-甲基磺酰苯酚 | 20951-05-7

• 分子结构分类: 有机化合物 - 苯类化合物 - 苯和取代衍生物
• 中文名称: 2,6-二氯-4-甲基磺酰苯酚
• 中文别名: 2,6-二氯-4-甲基磺酰基苯酚
• 英文名称: 2,6-Dichloro-4-methylsulfonylphenol
• 英文别名: 2,6-Dichloro-4-(methylsulfonyl)phenol
• CAS: 20951-05-7
• 化学式: C₇H₆Cl₂O₃S
• mdl: MFCD00216500
• 分子量: 241.095
• InChiKey: CTBGNTCBLZAIRI-UHFFFAOYSA-N

物化性质

• 熔点：
  223-224 °C
• 沸点：
  400.0±42.0 °C(Predicted)
• 密度：
  1.4879 (estimate)
• 稳定性/保质期：
  <p>遵照规定使用和储存，则不会分解。</p>

计算性质

• 辛醇/水分配系数(LogP)：
  2.3
• 重原子数：
  13
• 可旋转键数：
  1
• 环数：
  1.0
• sp3杂化的碳原子比例：
  0.142
• 拓扑面积：
  62.8
• 氢给体数：
  1
• 氢受体数：
  3

安全信息

• 危险品标志：
  Xi
• 安全说明：
  S24/25
• 海关编码：
  2908999090

SDS

Name:	2 6-Dichloro-4-Methylsulphonyl Phenol 95+% Material Safety Data Sheet
Synonym:	None known
CAS:	20951-05-7

Section 1 - Chemical Product MSDS Name:2 6-Dichloro-4-Methylsulphonyl Phenol 95+% Material Safety Data Sheet
Synonym:None known

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Section 2 - COMPOSITION, INFORMATION ON INGREDIENTS

CAS#	Chemical Name	content	EINECS#
20951-05-7	2,6-Dichloro-4-Methylsulphonyl Phenol	95	unlisted

Hazard Symbols: None Listed.
Risk Phrases: None Listed.

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Section 3 - HAZARDS IDENTIFICATION
EMERGENCY OVERVIEW
The toxicological properties of this material have not been fully investigated.
Potential Health Effects
Eye:
May cause eye irritation.
Skin:
May cause skin irritation.
Ingestion:
May cause irritation of the digestive tract. The toxicological properties of this substance have not been fully investigated.
Inhalation:
May cause respiratory tract irritation. The toxicological properties of this substance have not been fully investigated.
Chronic:
No information found.

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Section 4 - FIRST AID MEASURES
Eyes: Flush eyes with plenty of water for at least 15 minutes, occasionally lifting the upper and lower eyelids. Get medical aid.
Skin:
Get medical aid. Flush skin with plenty of water for at least 15 minutes while removing contaminated clothing and shoes. Wash clothing before reuse.
Ingestion:
Never give anything by mouth to an unconscious person. Get medical aid. Do NOT induce vomiting. If conscious and alert, rinse mouth and drink 2-4 cupfuls of milk or water.
Inhalation:
Remove from exposure and move to fresh air immediately. If not breathing, give artificial respiration. If breathing is difficult, give oxygen. Get medical aid.
Notes to Physician:

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Section 5 - FIRE FIGHTING MEASURES
General Information:
As in any fire, wear a self-contained breathing apparatus in pressure-demand, MSHA/NIOSH (approved or equivalent), and full protective gear. During a fire, irritating and highly toxic gases may be generated by thermal decomposition or combustion.
Extinguishing Media:
Use agent most appropriate to extinguish fire. Use water spray, dry chemical, carbon dioxide, or appropriate foam.

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Section 6 - ACCIDENTAL RELEASE MEASURES
General Information: Use proper personal protective equipment as indicated in Section 8.
Spills/Leaks:
Vacuum or sweep up material and place into a suitable disposal container. Clean up spills immediately, observing precautions in the Protective Equipment section. Avoid generating dusty conditions.
Provide ventilation.

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Section 7 - HANDLING and STORAGE
Handling:
Wash thoroughly after handling. Remove contaminated clothing and wash before reuse. Use with adequate ventilation. Minimize dust generation and accumulation. Avoid contact with eyes, skin, and clothing. Keep container tightly closed. Avoid ingestion and inhalation.
Storage:
Store in a tightly closed container. Store in a cool, dry, well-ventilated area away from incompatible substances.

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Section 8 - EXPOSURE CONTROLS, PERSONAL PROTECTION
Engineering Controls:
Facilities storing or utilizing this material should be equipped with an eyewash facility and a safety shower. Use adequate ventilation to keep airborne concentrations low.
Exposure Limits CAS# 20951-05-7: Personal Protective Equipment Eyes: Wear appropriate protective eyeglasses or chemical safety goggles as described by OSHA's eye and face protection regulations in 29 CFR 1910.133 or European Standard EN166.
Skin:
Wear appropriate protective gloves to prevent skin exposure.
Clothing:
Wear appropriate protective clothing to prevent skin exposure.
Respirators:
A respiratory protection program that meets OSHA's 29 CFR 1910.134 and ANSI Z88.2 requirements or European Standard EN 149 must be followed whenever workplace conditions warrant respirator use.

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Section 9 - PHYSICAL AND CHEMICAL PROPERTIES

Physical State: Powder
Color: white
Odor: none reported
pH: Not available.
Vapor Pressure: Not available.
Viscosity: Not available.
Boiling Point: Not available.
Freezing/Melting Point: 223.00 - 224.00 deg C
Autoignition Temperature: Not applicable.
Flash Point: Not applicable.
Explosion Limits, lower: Not available.
Explosion Limits, upper: Not available.
Decomposition Temperature:
Solubility in water:
Specific Gravity/Density:
Molecular Formula: C7H6Cl2O3S
Molecular Weight: 241.09

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Section 10 - STABILITY AND REACTIVITY
Chemical Stability:
Stable under normal temperatures and pressures.
Conditions to Avoid:
Incompatible materials, dust generation, excess heat, strong oxidants.
Incompatibilities with Other Materials:
Oxidizing agents.
Hazardous Decomposition Products:
Hydrogen chloride, carbon monoxide, oxides of sulfur, irritating and toxic fumes and gases, carbon dioxide, hydrogen sulfide.
Hazardous Polymerization: Has not been reported

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Section 11 - TOXICOLOGICAL INFORMATION
RTECS#:
CAS# 20951-05-7 unlisted.
LD50/LC50:
Not available.
Carcinogenicity:
2,6-Dichloro-4-Methylsulphonyl Phenol - Not listed by ACGIH, IARC, or NTP.

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Section 12 - ECOLOGICAL INFORMATION

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Section 13 - DISPOSAL CONSIDERATIONS
Dispose of in a manner consistent with federal, state, and local regulations.

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Section 14 - TRANSPORT INFORMATION

IATA
Not regulated as a hazardous material.
IMO
Not regulated as a hazardous material.
RID/ADR
Not regulated as a hazardous material.

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Section 15 - REGULATORY INFORMATION

European/International Regulations
European Labeling in Accordance with EC Directives
Hazard Symbols: Not available.
Risk Phrases:
Safety Phrases:
S 24/25 Avoid contact with skin and eyes.
S 28A After contact with skin, wash immediately with
plenty of water.
S 37 Wear suitable gloves.
S 45 In case of accident or if you feel unwell, seek
medical advice immediately (show the label where
possible).
WGK (Water Danger/Protection)
CAS# 20951-05-7: No information available.
Canada
None of the chemicals in this product are listed on the DSL/NDSL list.
CAS# 20951-05-7 is not listed on Canada's Ingredient Disclosure List.
US FEDERAL
TSCA
CAS# 20951-05-7 is not listed on the TSCA inventory.
It is for research and development use only.

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SECTION 16 - ADDITIONAL INFORMATION
N/A

反应信息

• 作为反应物：
  描述：

  2,6-二氯-4-甲基磺酰苯酚 、 氯甲酸乙酯 在 三乙胺 作用下， 生成 Carbonic acid 2,6-dichloro-4-methanesulfonyl-phenyl ester ethyl ester
  参考文献：
  名称：

  GB1128217

  摘要：

  公开号：

文献信息

• GPR119 Receptor Agonists
  申请人：Erickson Shawn David

  公开号：US20090286812A1

  公开（公告）日：2009-11-19

  Provided herein are compounds of the formula (I): as well as pharmaceutically acceptable salts thereof, wherein the substituents are as those disclosed in the specification. These compounds, and the pharmaceutical compositions containing them, are useful for the treatment of metabolic diseases and disorders such as, for example, type II diabetes mellitus.

  提供以下公式(I)的化合物： 以及可药用的接受盐，其中取代基如说明书中所披露。这些化合物以及含有它们的药物组合物可用于治疗代谢性疾病和障碍，例如，2型糖尿病。
• SULFUR ATOM-CONTAINING COMPOSITION FOR RESIST UNDERLAYER FILM FORMATION AND METHOD FOR RESIST PATTERN FORMATION
  申请人：Nissan Chemical Industries, Ltd.

  公开号：EP2237110A1

  公开（公告）日：2010-10-06

  It is an object to provide a resist underlayer film forming composition having a selection ratio of dry etching rate larger than that of a resist film and exhibiting a low k value and a high n value at a short wavelength such as that of an ArF excimer laser, and enabling the formation of a resist pattern having a desired shape. When the composition is produced or used, it is required that odor due to a raw material monomer causes no problem. The object is solved by a resist underlayer film forming composition for lithography containing a polymer having in backbone thereof, a disulfide bond (S-S bond), and a solvent. The polymer may be a product of a reaction between at least one type of compound (diepoxy compound) containing two epoxy groups and at least one type of dicarboxylic acid containing a disulfide bond.

  目的是提供一种抗蚀剂底层成膜组合物，该组合物的干蚀刻率选择比大于抗蚀剂薄膜的干蚀刻率选择比，并且在短波长（例如 ArF 准分子激光波长）下具有低 k 值和高 n 值，能够形成具有所需形状的抗蚀剂图案。在生产或使用该组合物时，要求原材料单体不会产生异味。光刻用抗蚀剂底层成膜组合物解决了这一问题，该组合物含有一种聚合物，其骨架中含有二硫键（S-S 键）和一种溶剂。该聚合物可以是至少一种含有两个环氧基团的化合物（二环氧化合物）与至少一种含有二硫键的二羧酸反应的产物。
• Self-organized film-forming composition for use in forming a micro-phase-separated pattern
  申请人：NISSAN CHEMICAL CORPORATION

  公开号：US10995172B2

  公开（公告）日：2021-05-04

  A self-assembled film-forming composition for orthogonally inducing, with respect to a substrate, a microphase separation structure in a layer including a block copolymer, in the whole surface of a coating film, even at high heating temperatures at which arrangement failure of the microphase separation of the block copolymer occurs. The self-assembled film-forming composition includes a block copolymer, and at least two solvents having different boiling points as a solvent. The block copolymer is obtained by bonding: a non-silicon-containing polymer having, as a structural unit, styrene, a derivative thereof, or a structure derived from a lactide; and a silicon-containing polymer having, as a structural unit, styrene substituted with silicon-containing groups. The solvent includes: a low boiling point solvent (A) having a boiling point of 160° C. or lower; and a high boiling point solvent (B) having a boiling point of 170° C. or higher.

  一种自组装成膜组合物，用于在包括嵌段共聚物的层中正交诱导涂膜整个表面的微相分离结构，即使在嵌段共聚物的微相分离发生排列失效的高加热温度下也是如此。自组装成膜组合物包括嵌段共聚物和至少两种具有不同沸点的溶剂。嵌段共聚物是通过粘合以下两种聚合物而得到的：一种是不含硅的聚合物，其结构单元为苯乙烯、苯乙烯的衍生物或由内酯衍生的结构；另一种是含硅的聚合物，其结构单元为被含硅基团取代的苯乙烯。溶剂包括：沸点为 160℃或更低的低沸点溶剂 (A)；沸点为 170℃或更高的高沸点溶剂 (B)。
• GPR119 RECEPTOR AGONISTS
  申请人：F. Hoffmann-La Roche AG

  公开号：EP2283019A1

  公开（公告）日：2011-02-16
• SULFUR ATOM-CONTAINING RESIST UNDERLAYER FILM FORMING COMPOSITION AND METHOD FOR FORMING RESIST PATTERN
  申请人：Hiroi Yoshiomi

  公开号：US20110053091A1

  公开（公告）日：2011-03-03

  It is an object to provide a resist underlayer film forming composition having a selection ratio of dry etching rate larger than that of a resist film and exhibiting a low k value and a high n value at a short wavelength such as that of an ArF excimer laser, and enabling the formation of a resist pattern having a desired shape. When the composition is produced or used, it is required that odor due to a raw material monomer causes no problem. The object is solved by a resist underlayer film forming composition for lithography containing a polymer having in backbone thereof, a disulfide bond (S—S bond), and a solvent. The polymer may be a product of a reaction between at least one type of compound (diepoxy compound) containing two epoxy groups and at least one type of dicarboxylic acid containing a disulfide bond.