Copper-catalyzed Ullmann coupling under ligand- and additive-free conditions. Part 2: S-Arylation of thiols with aryl iodides
作者:Pongchart Buranaprasertsuk、Joyce Wei Wei Chang、Warinthorn Chavasiri、Philip Wai Hong Chan
DOI:10.1016/j.tetlet.2008.01.060
日期:2008.3
S-Arylation of a wide variety of substituted aryl and aliphatic thiols with aryl halides catalyzed by copper iodide under mild ligand- and additive-free conditions (nBu4NBr, PhMe, NaOH, reflux, 22 h) is accomplished in good to excellent product yields (up to 96%).
在温和的无配体和无添加剂条件下(n Bu 4 NBr,PhMe,NaOH,回流,22 h),将各种取代的芳基和脂肪族硫醇与碘化铜催化的芳基卤化物进行S-芳基化反应产品收率(高达96%)。