A low-temperature thermal ALD process for nickel utilizing dichlorobis(triethylphosphine)nickel(<scp>ii</scp>) and 1,4-bis(trimethylgermyl)-1,4-dihydropyrazine
In this work, we developed a new ALD process for nickel metal from dichlorobis(triethylphosphine)nickel(II) (NiCl2(PEt3)2) and 1,4-bis(trimethylgermyl)-1,4-dihydropyrazine ((Me3Ge)2DHP). A series of phosphine adducts of nickel and cobalt halides were synthesized and characterized for their volatility and thermal stability. Also (Me3Ge)2DHP is a novel reducing agent in ALD. Smooth nickel films were