N-(benzyloxycarbonyl)-2,6-dimethylpiperidine | 117139-95-4

• 分子结构分类: 有机化合物 - 苯类化合物 - 苯和取代衍生物
• 英文名称: N-(benzyloxycarbonyl)-2,6-dimethylpiperidine
• 英文别名: Benzyl 2,6-dimethylpiperidine-1-carboxylate
• CAS: 117139-95-4
• 化学式: C₁₅H₂₁NO₂
• 分子量: 247.337
• InChiKey: OWDOUERXHFTHJS-UHFFFAOYSA-N

物化性质

• 沸点：
  349.8±21.0 °C(Predicted)
• 密度：
  1.048±0.06 g/cm3(Predicted)

计算性质

• 辛醇/水分配系数(LogP)：
  3.3
• 重原子数：
  18
• 可旋转键数：
  3
• 环数：
  2.0
• sp3杂化的碳原子比例：
  0.53
• 拓扑面积：
  29.5
• 氢给体数：
  0
• 氢受体数：
  2

反应信息

• 作为产物：
  描述：

  氯甲酸苄酯 、 2,6-二甲基哌啶 以 四氢呋喃 、 甲苯 为溶剂， 反应 3.0h， 以41%的产率得到N-(benzyloxycarbonyl)-2,6-dimethylpiperidine
  参考文献：
  名称：

  Thermo-base Generator for Low Temperature Solid-phase Imidation of Poly(amic acid)

  摘要：

  已开发出能够释放次环状胺（例如2,6-二甲基哌啶；DMP）的高效热碱发生器（TBG），用于聚酰胺酸（PAA）的低温固相酰亚胺化。这类潜在的热敏催化剂能促进PAA膜在高达200°C时的热酰亚胺化过程，而不形成盐类并避免PAA溶液的储存不稳定性。

  DOI：

  10.1246/cl.2005.1372

文献信息

• LONG-CHAIN ALKYLENE GROUP-CONTAINING EPOXY RESIN COMPOSITION
  申请人：Nissan Chemical Corporation

  公开号：EP3375804A1

  公开（公告）日：2018-09-19

  There is provided an epoxy resin composition containing an epoxy compound, which has a low viscosity and a low dielectric constant, and when added to a general-purpose epoxy resin composition, can lower a viscosity of the composition and can sufficiently lower a dielectric constant of an epoxy resin cured product obtained from the composition. An epoxy resin composition comprising: (a) an epoxy component containing at least an epoxy compound of formula [1]; and (b) a curing agent: wherein R1 to R3 each independently are a hydrogen atom or methyl group, and L1 to L3 each independently are pentamethylene group, hexamethylene group or heptamethylene group.

  提供了一种含有环氧化合物的环氧树脂组合物，该环氧化合物具有低粘度和低介电常数，当添加到通用环氧树脂组合物中时，可降低组合物的粘度，并可充分降低由该组合物固化的环氧树脂产品的介电常数。一种环氧树脂组合物，包括：(a) 至少含有式[1]环氧化合物的环氧组分；(b) 固化剂： 其中 R1 至 R3 各自独立地为氢原子或甲基，L1 至 L3 各自独立地为五亚甲基、六亚甲基或七亚甲基。
• POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, POSITIVE PHOTOSENSITIVE DRY FILM, METHOD FOR PRODUCING POSITIVE PHOTOSENSITIVE DRY FILM, PATTERNING PROCESS, METHOD FOR FORMING CURED FILM, INTERLAYER INSULATION FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT
  申请人：Shin-Etsu Chemical Co., Ltd.

  公开号：EP3951498A1

  公开（公告）日：2022-02-09

  The present invention is a positive photosensitive resin composition including: (A) an alkali-soluble resin containing at least one or more structures selected from a polyimide structure, a polybenzoxazole structure, a polyamide-imide structure, and a precursor structure thereof; (B) a crosslinkable polymer compound containing a structural unit represented by the following general formula (1) and having a group crosslinked with the component (A); and (C) a compound having a quinonediazide structure for serving as a photosensitizer to generate an acid by light and increase a dissolution speed to an alkaline aqueous solution. An object of the present invention is to provide a positive photosensitive resin composition and a positive photosensitive dry film that enable formation of a fine pattern and high resolution, have excellent mechanical characteristics even when cured at low temperatures, and have no degradation in adhesive force between before and after a high temperature and high humidity test.

  本发明是一种正性光敏树脂组合物，包括(A)一种碱溶性树脂，含有至少一种或多种选自聚酰亚胺结构、聚苯并恶唑结构、聚酰胺-酰亚胺结构及其前体结构的结构；(B)一种可交联聚合物化合物，含有由下式(1)表示的结构单元，并具有与组分(A)交联的基团；以及(C)一种具有喹酮噻嗪结构的化合物，用作光敏剂，通过光产生酸，并提高对碱性水溶液的溶解速度。本发明的目的是提供一种正感光树脂组合物和一种正感光干膜，这种组合物和干膜能形成精细的图案和高分辨率，即使在低温下固化也具有优良的机械特性，而且在高温高湿试验前后粘合力不会下降。
• Curable composition including siloxane oligomer and inorganic fine particles
  申请人：NISSAN CHEMICAL INDUSTRIES, LTD.

  公开号：US10125267B2

  公开（公告）日：2018-11-13

  A material having a low refractive index that exhibits sufficiently low refractive index without deteriorating the strength of cured film produced therefrom, that can be cured by an active energy ray that is applicable for a resin base material that is not desired to be exposed to heat. Curable composition including: siloxane oligomer (a) containing a radically polymerizable double bond obtained through hydrolysis and condensation of alkoxysilanes containing at least an alkoxysilane A of Formula [1] and alkoxysilane B of Formula [2] in an amount of 100 parts by mass; inorganic fine particles (b) in amount of 10 parts by mass to 1,000 parts by mass; polymerization initiator (c) generating a radical upon active energy ray irradiation in an amount of 0.1 parts by mass to 25 parts by mass R1aSi(OR2)4-a  [1] R3bSi(OR4)4-b  [2] a cured film produced from the composition, and a laminate including a low refractive index layer produced from the composition.

  一种具有低折射率的材料，该材料具有足够低的折射率，且不会降低由其制成的固化膜的强度，可通过活性能量射线固化，适用于不希望受热的树脂基材料。可固化组合物，包括：硅氧烷低聚物 (a)，其中含有通过水解和缩合至少含有式 [1] 烷氧基硅烷 A 和式 [2] 烷氧基硅烷 B 的烷氧基硅烷而获得的可辐射聚合双键，其用量为 100 份（按质量计）；无机微粒 (b)，其用量为 10 份（按质量计）至 1 000 份（按质量计）；聚合引发剂 (c)，其用量为 0.1 份（按质量计）至 25 份（按质量计）。 R1aSi(OR2)4-a [1] R3bSi(OR4)4-b [2] 由该组合物制成的固化薄膜，以及包括由该组合物制成的低折射率层的层压板。
• Photosensitive resin composition, protective film, and liquid crystal display element
  申请人：Chi Mei Corporation

  公开号：US10162260B2

  公开（公告）日：2018-12-25

  The invention shows a photosensitive resin composition which can be used in protective film and liquid crystal display element and provides good transparency and high chemical resistance. The composition includes a complex resin (A), an o-naphthoquinone diazide sulfonate (B), and a solvent (C). The complex resin (A) includes a main chain and a side chain. The main chain includes a repeating unit derived from siloxane (meth)acrylate based monomer (a1-2). The side chain includes a repeating unit derived from siloxane based monomer (a2), and is bonded to the repeating unit derived from siloxane (meth)acrylate based monomer (a1-2). The complex resin (A) satisfies at least one of the following conditions (I) and (II): Condition (I): the main chain further includes a repeating unit derived from unsaturated monomer (a1-1) including a carboxylic acid or a carboxylic anhydride. Condition (II): the siloxane based monomer (a2) includes a monomer (a2-1) represented by formula (A-4).

  本发明展示了一种光敏树脂组合物，可用于保护膜和液晶显示元件，具有良好的透明性和高耐化学腐蚀性。该组合物包括复合树脂（A）、邻萘醌重氮磺酸盐（B）和溶剂（C）。复合树脂（A）包括一条主链和一条侧链。主链包括由硅氧烷（甲基）丙烯酸酯单体（a1-2）衍生的重复单元。侧链包括硅氧烷基单体（a2）衍生的重复单元，并与硅氧烷（甲基）丙烯酸酯基单体（a1-2）衍生的重复单元键合。复合树脂（A）至少满足以下条件（I）和（II）之一： 条件 (I)：主链还包括一个由不饱和单体（a1-1）衍生的重复单元，不饱和单体（a1-1）包括羧酸或羧酸酐。 条件（II）：硅氧烷基单体（a2）包括由式（A-4）表示的单体（a2-1）。
• Precursor for polyimide and use thereof
  申请人：ETERNAL MATERIALS CO., LTD.

  公开号：US10626220B2

  公开（公告）日：2020-04-21

  The present invention provides an amic acid ester oligomer having a structure of Formula (1) or (1′): wherein G, P, R, Rx, D, E and m are as defined in the specification. The present invention also provides a polyimide precursor composition comprising the amic acid ester oligomer, as well as a polyimide prepared from the composition.

  本发明提供了一种具有式（1）或（1′）结构的胺基酸酯低聚物： 其中 G、P、R、Rx、D、E 和 m 如说明书中所定义。本发明还提供了一种聚酰亚胺前体组合物，该组合物中包含该胺基酸酯低聚物，以及由该组合物制备的聚酰亚胺。