A pyrimidone derivative having tau protein kinase 1 inhibitory activity which is represented by formula (I) or a salt thereof, or a solvate thereof or a hydrate thereof; useful for prventive and/or therapeutic treatment of diseass such as neurodegenerative diseases (e.g. Alzheimer disease); wherein Q represents CH or nitrogen atom; R represents a C
1
-C
12
alkyl group; the ring of Formula (I): represents piperazine ring or piperidine ring; each X independently represents a C
1
-C
8
alkyl group, an optionally partially hydrogenated C
6
-C
10
aryl ring, an indan ring or the like; m represents an integer of 1 to 3; each independently represents a halogen atom, a hydroxy group, a cyano group, a C
1
-C
6
alkyl group or the like; n represents an integer of 0 to 8; when X and Y or two Y groups are attached on the same carbon atom, they may combine to each other to form a C
2
-C
6
alkylene group.
Photocatalysis and Kinetic Resolution by Lithiation to Give Enantioenriched 2-Arylpiperazines
作者:Anjan Das、Anthony Choi、Iain Coldham
DOI:10.1021/acs.orglett.3c00074
日期:2023.2.17
Piperazines are important heterocycles in drug compounds. We report the asymmetric synthesis of arylpiperazines by photocatalytic decarboxylative arylation (metallaphotoredox catalysis) then kinetic resolution using n-BuLi/(+)-sparteine. This gave a range of piperazines with very high enantioselectivities. Further functionalizations gave enantioenriched 2,2-disubstituted piperazines, and either N-substituent
A pyrimidone derivative having tau protein kinase 1 inhibitory activity which is represented by formula (I) or a salt thereof, or a solvate thereof or a hydrate thereof:
wherein Q represents CH or nitrogen atom; R represents a C1-C12 alkyl group; the ring of:
represents piperazine ring or piperidine ring.
Chemical mechanical planarization for tungsten-containing substrates
申请人:AIR PRODUCTS AND CHEMICALS, INC.
公开号:EP2779217A2
公开(公告)日:2014-09-17
Chemical mechanical polishing (CMP) compositions for polishing tungsten or tungsten-containing substrates comprise an abrasive, at least one solid catalyst, a chemical additive selected from the groups consisting of piperazine derivatives, salts of cyanate, and combinations thereof; and a liquid carrier. Systems and processes use the aqueous formulations for polishing tungsten or tungsten-containing substrates.